Intel® Xeon® Processors

Intel® Xeon® Processor E5-2440

15M Cache, 2.40 GHz, 7.20 GT/s Intel® QPI

Specifications

Performance

Supplemental Information

Expansion Options

Package Specifications

  • Sockets Supported FCLGA1356
  • Max CPU Configuration 2
  • Package Size 45mm x 42.5mm
  • Low Halogen Options Available See MDDS

Compatible Products

Server Chipsets

Product Name Status PCI Express Revision USB Revision Embedded Options Available TDP Recommended Customer Price Compare
All | None
Intel® C608 Chipset Launched 2.0 2.0 No 12 W $88.00
Intel® C606 Chipset Launched 2.0 2.0 No 12 W N/A
Intel® C604 Chipset Launched 2.0 2.0 Yes 8 W $61.00
Intel® C602J Chipset Launched 2.0 2.0 Yes 8 W $55.00

Single-Socket Server Boards

Product Name Status Board Form Factor Chassis Form Factor Socket Embedded Options Available TDP Compare
All | None
Intel® Server Board S1400FP2 End of Life ATX 4U Rack or Pedestal Socket B2 No 95 W
Intel® Server Board S1400FP4 End of Life ATX 4U Rack or Pedestal Socket B2 No 95 W
Intel® Server Board S1400SP2 End of Life ATX 1U Rack Socket B2 Yes 95 W
Intel® Server Board S1400SP4 End of Life SSI ATX 12" X 9.6" 1U Rack Socket B2 Yes 95 W

Dual-Socket Server Boards

Product Name Status Board Form Factor Chassis Form Factor Socket Embedded Options Available TDP Compare
All | None
Intel® Server Board S2400BB4 End of Life Custom 13.5'' x 13.5'' Rack Socket B2 No 95 W
Intel® Server Board S2400EP2 End of Life SSI CEB 12" x 10.5" 1U Rack Socket B2 Yes 95 W
Intel® Server Board S2400EP4 End of Life SSI CEB 12" x 10.5" 1U Rack Socket B2 Yes 95 W
Intel® Server Board S2400GP2 End of Life SSI EEB 12" x 13" Pedestal Socket B2 No 95 W
Intel® Server Board S2400GP4 End of Life SSI EEB 12" x 13" Pedestal Socket B2 No 95 W
Intel® Server Board S2400LP End of Life Custom 6.8'' x 16.6'' 2U Rack Socket B2 No 95 W
Intel® Server Board S2400SC2 End of Life SSI CEB 12" x 10.5" 4U Rack or Pedestal Socket B2 No 95 W

Intel® Compute Modules

Product Name Status Board Form Factor Chassis Form Factor Socket Embedded Options Available TDP Compare
All | None
Intel® Compute Module HNS2400LP End of Life Custom 6.8'' x 16.6'' Rack Socket B2 No 95 W

1U Rack Server Systems

Product Name Status Chassis Form Factor Board Form Factor Socket Compare
All | None
Intel® Server System R1208BB4DC End of Life 1U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R1208BB4GS9 End of Life 1U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R1304BB4DC End of Life 1U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R1304BB4GS9 End of Life 1U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R1208EP2SHFN End of Life 1U Rack SSI CEB (12" X 10.5") Socket B2
Intel® Server System R1304EP2SFFN End of Life 1U Rack SSI CEB (12" X 10.5") Socket B2
Intel® Server System R1304EP2SHFN End of Life 1U Rack SSI CEB 12" X 10.5" Socket B2
Intel® Server System R1304SP2SFBN End of Life 1U Rack SSI ATX (12" X 9.6") Socket B2
Intel® Server System R1304SP2SHBN End of Life 1U Rack ATX Socket R3
Intel® Server System R1304SP4SHOC End of Life 1U Rack ATX 12" x 9.6" Socket B2

2U Rack Server Systems

Product Name Status Chassis Form Factor Board Form Factor Socket Compare
All | None
Intel® Server System H2216LPJR End of Life 2U Rack Custom 6.8'' x 16.6'' Socket B2
Intel® Server System H2312LPJR End of Life 2U Rack Custom 6.8'' x 16.6'' Socket B2
Intel® Server System R2000BB4GS9 End of Life 2U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R2208BB4GC End of Life 2U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R2208BB4GS9 End of Life 2U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R2216BB4GC End of Life 2U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R2224BB4GCSAS End of Life 2U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R2308BB4GC End of Life 2U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R2312BB4GS9 End of Life 2U Rack Custom 13.5'' x 13.5'' Socket B2
Intel® Server System R2308SC2SHDR End of Life 2U Rack SSI CEB (12" X 10.5") Socket B2
Intel® Server System R2308SC2SHFN End of Life 2U Rack SSI CEB 12" X 10.5" Socket B2
Intel® Server System R2312SC2SHGR End of Life 2U Rack SSI CEB 12" X 10.5" Socket B2

4U Pedestal (Rackable) Server Systems

Product Name Status Chassis Form Factor Board Form Factor Socket Compare
All | None
Intel® Server System P4304SC2SFEN End of Life 4U Pedestal SSI CEB 12" X 10.5" Socket B2
Intel® Server System P4304SC2SHDR End of Life 4U Pedestal SSI CEB (12" X 10.5") Socket B2
Intel® Server System P4308SC2MHGC End of Life 4U Pedestal SSI CEB 12" X 10.5" Socket B2

Product Images

Block Diagram

Ordering and Compliance

Ordering and spec information

Intel® Xeon® Processor E5-2440 (15M Cache, 2.40 GHz) FC-LGA10, Tray

  • Spec Code SR0LK
  • Ordering Code CM8062000862604
  • Step C2
  • RCP $832.00

Retired and discontinued

Boxed Intel® Xeon® Processor E5-2440 (15M Cache, 2.40 GHz) FC-LGA10

  • Spec Code SR0LK
  • Ordering Code BX80621E52440
  • Step C2
  • RCP $837.00

Trade compliance information

  • ECCN5A992C
  • CCATSG077159
  • US HTS8542310001

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Recommended Customer Price

Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency

Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

# of QPI Links

QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

VID Voltage Range

VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® Identity Protection Technology

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

QR

Quality/Reliability Hold.

RS

Reschedule

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

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