Intel® Xeon® Processors

Intel® Xeon® Silver 4108 Processor

11M Cache, 1.80 GHz

Specifications

Performance

Memory Specifications

Expansion Options

Package Specifications

Compatible Products

1U Rack Server Systems

Product Name Status Chassis Form Factor Board Form Factor Socket Compare
All | None
Intel® Server System R1208WFTYS Launched 1U, Spread Core Rack Custom 16.7" x 17" Socket P
Intel® Server System R1304WF0YS Launched 1U, Spread Core Rack Custom 16.7" x 17" Socket P
Intel® Server System R1304WFTYS Launched 1U, Spread Core Rack Custom 16.7" x 17" Socket P

2U Rack Server Systems

Product Name Status Chassis Form Factor Board Form Factor Socket Compare
All | None
Intel® Server System R2208WF0ZS Launched 2U, Spread Core Rack Custom 16.7" x 17" Socket P
Intel® Server System R2208WFTZS Launched 2U, Spread Core Rack Custom 16.7" x 17" Socket P
Intel® Server System R2224WFTZS Launched 2U, Spread Core Rack Custom 16.7" x 17" Socket P
Intel® Server System R2308WFTZS Launched 2U, Spread Core Rack Custom 16.7" x 17" Socket P
Intel® Server System R2312WF0NP Launched 2U, Spread Core Rack Custom 16.7" x 17" Socket P
Intel® Server System R2312WFTZS Launched 2U, Spread Core Rack Custom 16.7" x 17" Socket P

Dual-Socket Server Boards

Product Name Status Board Form Factor Chassis Form Factor Socket Embedded Options Available TDP Compare
All | None
Intel® Server Board S2600BPB Launched Custom 6.8" x 19.1" Rack Socket P No 165 W
Intel® Server Board S2600BPQ Launched Custom 6.8" x 19.1" Rack Socket P No 165 W
Intel® Server Board S2600BPS Launched Custom 6.8" x 19.1" Rack Socket P No 165 W
Intel® Server Board S2600STB Launched SSI EEB (12 x 13 in) Rack or Pedestal Socket P No 205 W
Intel® Server Board S2600STQ Launched SSI EEB (12 x 13 in) Rack or Pedestal Socket P No 205 W
Intel® Server Board S2600WF0 Launched Custom 16.7" x 17" Rack Socket P No 205 W
Intel® Server Board S2600WFT Launched Custom 16.7" x 17" Rack Socket P No 205 W

Intel® Compute Modules

Product Name Status Board Form Factor Chassis Form Factor Socket Embedded Options Available TDP Compare
All | None
Intel® Compute Module HNS2600BPB24 Launched Custom 6.8" x 19.1" 2U Rack Socket P No 165 W
Intel® Compute Module HNS2600BPB Launched Custom 6.8" x 19.1" 2U Rack Socket P No 165 W
Intel® Compute Module HNS2600BPQ Launched Custom 6.8" x 19.1" 2U Rack Socket P No 165 W
Intel® Compute Module HNS2600BPQ24 Launched Custom 6.8" x 19.1" 2U Rack Socket P No 165 W
Intel® Compute Module HNS2600BPS Launched Custom 6.8" x 19.1" 2U Rack Socket P No 165 W
Intel® Compute Module HNS2600BPS24 Launched Custom 6.8" x 19.1" 2U Rack Socket P No 165 W

Ordering and Compliance

Ordering and spec information

Boxed Intel® Xeon® Silver 4108 Processor (11M Cache, 1.80 GHz) FC-LGA14B

  • Spec Code SR3GJ
  • Ordering Code BX806734108
  • Step U0
  • RCP $427.00

Intel® Xeon® Silver 4108 Processor (11M Cache, 1.80 GHz) FC-LGA14B, Tray

  • Spec Code SR3GJ
  • Ordering Code CD8067303561500
  • Step U0
  • RCP $417.00

Trade compliance information

  • ECCN5A992C
  • CCATSG077159
  • US HTS8542310001

PCN/MDDS Information

SR3GJ

Declaration of Conformity

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Recommended Customer Price

Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency

Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Conflict Free

“Conflict free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Speed Shift Technology

Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

Intel® Turbo Boost Max Technology 3.0

Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Technology

Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® TSX-NI

Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling.  This technology helps make parallel operations more efficient via improved control of locks in software.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

# of AVX-512 FMA Units

Intel® Advanced Vector Extensions 512 (AVX-512), new instruction set extensions, delivering ultra-wide (512-bit) vector operations capabilities, with up to 2 FMAs (Fused Multiply Add instructions), to accelerate performance for your most demanding computational tasks.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Volume Management Device (VMD)

Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Mode-based Execute Control (MBE)

Mode-based Execute Control can more reliably verify and enforce the integrity of kernel level code.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

QR

Quality/Reliability Hold.

RS

Reschedule

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

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