Intel® Server System D50DNP1MFALLC Acceleration Module
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® Server D50DNP Family
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Code Name
Products formerly Denali Pass
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Launch Date
Q1'23
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Marketing Status
Discontinued
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Expected Discontinuance
2023
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EOL Announce
Friday, May 5, 2023
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Last Order
Friday, June 30, 2023
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Limited 3-year Warranty
Yes
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Extended Warranty Available for Purchase (Select Countries)
Yes
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Supported Operating Systems
VMware*, Windows Server 2022*, Windows Server 2019*, Red Hat Linux*, SUSE Linux*, Ubuntu*, CentOS*
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Chassis Form Factor
2U Front IO, 4 node Rack
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Chassis Dimensions
597.7 x 437.1 x 40.6 mm (L x W x H)
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Board Form Factor
8.33” x 21.5”
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Rack Rails Included
Yes
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Compatible Product Series
4th Gen Intel® Xeon® Scalable Processors, 5th Gen Intel® Xeon® Scalable Processors
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Socket
Socket- E LGA4677
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TDP
350 W
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Heat Sink
(1) – D50DNP compute module liquid-cooling loop – iPC DNPLCLPCM
(1) – D50DNP accelerator module liquid-cooling loop – iPC DNPLCLPAM
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Heat Sink Included
Yes
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System Board
Intel® Server Board D50DNP1SB
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Board Chipset
Intel® C741 Chipset
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Target Market
High Performance Computing, Scalable Performance
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Rack-Friendly Board
Yes
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Included Items
(1) – Intel® Server Board D50DNP1SB – iPC D50DNP1SB
(1) – carrier baseboard (CBB) – iPC DNPLCPVCCBB
(1) – 1U full-width module tray – iPN M62560 -xxx
(1) – MCIO cable from P1_PE0 connector to CBB – iPN M82302 -xxx
(1) – MCIO cable from P0_PE2 connector to CBB – iPN M82304 -xxx
(1) – MCIO cable from P0_PE1 connector to CBB – iPN M82313 -xxx
(1) – MCIO cable from P1_PE3 connector to CBB – iPN M82316 -xxx
(1) – Signal cable from J_MISC connector to CBB – iPN M82334 -xxx
(2) – 1U riser bracket to support riser cards DNP1URISER and DNP1UMRISER – iPN M44890-xxx
(1) – 1U low-profile PCIe standard riser card – iPC DNP1URISER
(1) – 1U low-profile PCIe MCIO riser card – iPC DNP1UMRISER
(1) – MCIO cable for 1U left riser – iPN M40563-xxx
(1) – Compute module liquid-cooling loop – iPC DNPLCLPCM
(1) – Accelerator module liquid-cooling loop – iPC DNPLCLPAM
(1) – Power cable from 12 V to 48 V converter to CBB – iPN M52679 -xxx
(1) – Power cable from 12 V to 48 V converter to CBB – iPN M52680 -xxx
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Riser Card Included
1U PCIe MCIO Riser DNP1UMRISER
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Supplemental Information
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Description
Density-optimized 1U liquid-cooled compute module designed for HPC and AI application.
Supports two 4th Gen Intel® Xeon® Scalable or Intel® Xeon® CPU Max Series processors with 16 DDR5 DIMMs and up to four Intel® Data Center GPU Max Series modules.
Memory & Storage
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Memory Types
• DDR5 RDIMM
• DDR5 3DS-RDIMM
• DDR5 9x4 RDIMM
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# of Memory Slots
16
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Max Memory Size (dependent on memory type)
2 TB
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# of Internal Drives Supported
2
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Internal Drive Form Factor
M.2 SSD
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Intel® Optane™ Persistent Memory Supported
No
GPU Specifications
Expansion Options
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PCI Express Revision
5.0
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Riser Slot 1: Total # of Lanes
24
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Riser Slot 2: Total # of Lanes
24
I/O Specifications
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# of USB Ports
3
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Total # of SATA Ports
2
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USB Configuration
• One USB 3.0 port on the front panel
• Two USB 3.0 ports via breakout cable
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Max # of UPI Links
3
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# of Serial Ports
1
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Integrated LAN
10Gb Ethernet (RJ45) and 1Gb Ethernet (RJ45)
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# of LAN Ports
2
Package Specifications
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Max CPU Configuration
2
Advanced Technologies
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Advanced System Management key
Yes
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Intel® Optane™ Memory Supported ‡
No
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Intel® Remote Management Module Support
Yes
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Integrated BMC with IPMI
IPMI 2.0 and Redfish compliant
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Intel® Node Manager
Yes
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Intel® Rapid Storage Technology enterprise
Yes
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TPM Version
2.0
Security & Reliability
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Intel® Total Memory Encryption
Yes
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Intel® Software Guard Extensions (Intel® SGX)
Yes with Intel® SPS
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Intel® AES New Instructions
Yes
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Intel® Trusted Execution Technology ‡
Yes
Ordering and Compliance
Compatible Products
4th Gen Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Intel® Server Chassis FC2000 Family
Management Module Options
Spare Cable Options
Spare Heat-Sink Options
Spare Riser Card Options
Intel® Server Spares and Accessories
Intel® Optane™ DC SSD Series
Intel® Virtual RAID on CPU (Intel® VROC)
Drivers and Software
Description
Type
More
OS
Version
Date
All
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Latest Drivers & Software
Name
BIOS and Firmware Update Package for UEFI for Intel® Server D50DNP Family
BIOS and System Firmware Update Package (SFUP) for Windows* and Linux* for Intel® Server D50DNP Family
Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 741 Chipset
Onboard Video Driver for Linux* for Intel® Server Boards and Systems Based on Intel® 741 Chipset
Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 741 Chipset
Intel® Virtual RAID on CPU (Intel® VROC) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 741 Chipset
Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 741 Chipset
Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems
Server Information Retrieval Utility (SysInfo) for Intel® Server Boards and Intel® Server Systems
Server Firmware Update Utility(SysFwUpdt) for Intel® Server Boards and Intel® Server Systems
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® Optane™ Persistent Memory Supported
Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance. Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
Max # of UPI Links
Intel® Ultra Path Interconnect (UPI) links are a high speed, point-to-point interconnect bus between the processors, delivering increased bandwidth and performance over Intel® QPI.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
# of LAN Ports
LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Rapid Storage Technology enterprise
Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.
TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Intel® Total Memory Encryption
TME – Total Memory Encryption (TME) helps protect data against exposure via physical attack on memory, such as cold-boot attacks.
Intel® Software Guard Extensions (Intel® SGX)
Intel® Software Guard Extensions (Intel® SGX) provide applications the ability to create hardware enforced trusted execution protection for their applications’ sensitive routines and data. Intel® SGX provides developers a way to partition their code and data into CPU hardened trusted execution environments (TEE’s).
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.