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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® Server System D50DNP1MFALLC Acceleration Module

Specifications

Export specifications

Essentials

  • Product Collection Intel® Server D50DNP Family
  • Code Name Products formerly Denali Pass
  • Launch Date Q1'23
  • Marketing Status Discontinued
  • Expected Discontinuance 2023
  • EOL Announce Friday, May 5, 2023
  • Last Order Friday, June 30, 2023
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Supported Operating Systems VMware*, Windows Server 2022*, Windows Server 2019*, Red Hat Linux*, SUSE Linux*, Ubuntu*, CentOS*
  • Chassis Form Factor 2U Front IO, 4 node Rack
  • Chassis Dimensions 597.7 x 437.1 x 40.6 mm (L x W x H)
  • Board Form Factor 8.33” x 21.5”
  • Rack Rails Included Yes
  • Compatible Product Series 4th Generation Intel® Xeon® Scalable Processors
  • Socket Socket- E LGA4677
  • TDP 350 W
  • Heat Sink (1) – D50DNP compute module liquid-cooling loop – iPC DNPLCLPCM
    (1) – D50DNP accelerator module liquid-cooling loop – iPC DNPLCLPAM
  • Heat Sink Included Yes
  • System Board Intel® Server Board D50DNP1SB
  • Board Chipset Intel® C741 Chipset
  • Target Market High Performance Computing, Scalable Performance
  • Rack-Friendly Board Yes
  • Included Items (1) – Intel® Server Board D50DNP1SB – iPC D50DNP1SB
    (1) – carrier baseboard (CBB) – iPC DNPLCPVCCBB
    (1) – 1U full-width module tray – iPN M62560 -xxx
    (1) – MCIO cable from P1_PE0 connector to CBB – iPN M82302 -xxx
    (1) – MCIO cable from P0_PE2 connector to CBB – iPN M82304 -xxx
    (1) – MCIO cable from P0_PE1 connector to CBB – iPN M82313 -xxx
    (1) – MCIO cable from P1_PE3 connector to CBB – iPN M82316 -xxx
    (1) – Signal cable from J_MISC connector to CBB – iPN M82334 -xxx
    (2) – 1U riser bracket to support riser cards DNP1URISER and DNP1UMRISER – iPN M44890-xxx
    (1) – 1U low-profile PCIe standard riser card – iPC DNP1URISER
    (1) – 1U low-profile PCIe MCIO riser card – iPC DNP1UMRISER
    (1) – MCIO cable for 1U left riser – iPN M40563-xxx
    (1) – Compute module liquid-cooling loop – iPC DNPLCLPCM
    (1) – Accelerator module liquid-cooling loop – iPC DNPLCLPAM
    (1) – Power cable from 12 V to 48 V converter to CBB – iPN M52679 -xxx
    (1) – Power cable from 12 V to 48 V converter to CBB – iPN M52680 -xxx
  • Riser Card Included 1U PCIe MCIO Riser DNP1UMRISER

Supplemental Information

  • Description Density-optimized 1U liquid-cooled compute module designed for HPC and AI application.
    Supports two 4th Gen Intel® Xeon® Scalable or Intel® Xeon® CPU Max Series processors with 16 DDR5 DIMMs and up to four Intel® Data Center GPU Max Series modules.

Memory & Storage

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Ordering and Compliance

Retired and discontinued

Intel® Server System D50DNP1MFALLC Acceleration Module, Single

  • MM# 99ARWW
  • Ordering Code D50DNP1MFALLC
  • MDDS Content IDs 788112

Trade compliance information

  • ECCN 5A002U
  • CCATS G157815L1
  • US HTS 8473305100

PCN Information

Compatible Products

4th Gen Intel® Xeon® Scalable Processors

Product Name Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® Platinum 8490H Processor Q1'23 60 3.50 GHz 1.90 GHz 112.5 MB 350 W 5
Intel® Xeon® Platinum 8480+ Processor Q1'23 56 3.80 GHz 2.00 GHz 105 MB 350 W 10
Intel® Xeon® Platinum 8470Q Processor Q1'23 52 3.80 GHz 2.10 GHz 105 MB 350 W 20
Intel® Xeon® Platinum 8470 Processor Q1'23 52 3.80 GHz 2.00 GHz 105 MB 350 W 22
Intel® Xeon® Platinum 8468V Processor Q1'23 48 3.80 GHz 2.40 GHz 97.5 MB 330 W 24
Intel® Xeon® Platinum 8468H Processor Q1'23 48 3.80 GHz 2.10 GHz 105 MB 330 W 25
Intel® Xeon® Platinum 8468 Processor Q1'23 48 3.80 GHz 2.10 GHz 105 MB 350 W 26
Intel® Xeon® Platinum 8462Y+ Processor Q1'23 32 4.10 GHz 2.80 GHz 60 MB 300 W 28
Intel® Xeon® Platinum 8461V Processor Q1'23 48 3.70 GHz 2.20 GHz 97.5 MB 300 W 31
Intel® Xeon® Platinum 8460Y+ Processor Q1'23 40 3.70 GHz 2.00 GHz 105 MB 300 W 32
Intel® Xeon® Platinum 8460H Processor Q1'23 40 3.80 GHz 2.20 GHz 105 MB 330 W 33
Intel® Xeon® Platinum 8458P Processor Q1'23 44 3.80 GHz 2.70 GHz 82.5 MB 350 W 34
Intel® Xeon® Platinum 8454H Processor Q1'23 32 3.40 GHz 2.10 GHz 82.5 MB 270 W 37
Intel® Xeon® Platinum 8452Y Processor Q1'23 36 3.20 GHz 2.00 GHz 67.5 MB 300 W 38
Intel® Xeon® Platinum 8450H Processor Q1'23 28 3.50 GHz 2.00 GHz 75 MB 250 W 39
Intel® Xeon® Platinum 8444H Processor Q1'23 16 4.00 GHz 2.90 GHz 45 MB 270 W 40
Intel® Xeon® Gold 6458Q Processor Q1'23 32 4.00 GHz 3.10 GHz 60 MB 350 W 50
Intel® Xeon® Gold 6454S Processor Q1'23 32 3.40 GHz 2.20 GHz 60 MB 270 W 55
Intel® Xeon® Gold 6448Y Processor Q1'23 32 4.10 GHz 2.10 GHz 60 MB 225 W 57
Intel® Xeon® Gold 6448H Processor Q1'23 32 4.10 GHz 2.40 GHz 60 MB 250 W 60
Intel® Xeon® Gold 6444Y Processor Q1'23 16 4.00 GHz 3.60 GHz 45 MB 270 W 64
Intel® Xeon® Gold 6442Y Processor Q1'23 24 4.00 GHz 2.60 GHz 60 MB 225 W 68
Intel® Xeon® Gold 6438Y+ Processor Q1'23 32 4.00 GHz 2.00 GHz 60 MB 205 W 71
Intel® Xeon® Gold 6438M Processor Q1'23 32 3.90 GHz 2.20 GHz 60 MB 205 W 77
Intel® Xeon® Gold 6434H Processor Q1'23 8 4.10 GHz 3.70 GHz 22.5 MB 195 W 80
Intel® Xeon® Gold 6434 Processor Q1'23 8 4.10 GHz 3.70 GHz 22.5 MB 195 W 83
Intel® Xeon® Gold 6430 Processor Q1'23 32 3.40 GHz 2.10 GHz 60 MB 270 W 88
Intel® Xeon® Gold 6426Y Processor Q1'23 16 4.10 GHz 2.50 GHz 37.5 MB 185 W 93
Intel® Xeon® Gold 6418H Processor Q1'23 24 4.00 GHz 2.10 GHz 60 MB 185 W 100
Intel® Xeon® Gold 6416H Processor Q1'23 18 4.20 GHz 2.20 GHz 45 MB 165 W 103
Intel® Xeon® Gold 5420+ Processor Q1'23 28 4.10 GHz 2.00 GHz 52.5 MB 205 W 110
Intel® Xeon® Gold 5418Y Processor Q1'23 24 3.80 GHz 2.00 GHz 45 MB 185 W 113
Intel® Xeon® Gold 5416S Processor Q1'23 16 4.00 GHz 2.00 GHz 30 MB 150 W 120
Intel® Xeon® Gold 5415+ Processor Q1'23 8 4.10 GHz 2.90 GHz 22.5 MB 150 W 123

Intel® Xeon® CPU Max Series

Product Name Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® CPU Max 9480 Processor Q1'23 56 3.50 GHz 1.90 GHz 112.5 MB 350 W 1222
Intel® Xeon® CPU Max 9470 Processor Q1'23 52 3.50 GHz 2.00 GHz 105 MB 350 W 1224
Intel® Xeon® CPU Max 9468 Processor Q1'23 48 3.50 GHz 2.10 GHz 105 MB 350 W 1225
Intel® Xeon® CPU Max 9462 Processor Q1'23 32 3.50 GHz 2.70 GHz 75 MB 350 W 1226
Intel® Xeon® CPU Max 9460 Processor Q1'23 40 3.50 GHz 2.20 GHz 97.5 MB 350 W 1227

Intel® Server Chassis FC2000 Family

Product Name Marketing Status Chassis Form Factor Sort Order Compare
All | None
Intel® Server Chassis FC2FLC30W0 Full-Width Configuration Liquid-Cooled No PSUs Discontinued 2U Rack front IO 62641

Management Module Options

Compare
All | None

Spare Cable Options

Compare
All | None

Spare Heat-Sink Options

Compare
All | None

Spare Riser Card Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
1U PCIe Riser DNP1URISER Q1'23 Launched 65390
1U PCIe MCIO Riser DNP1UMRISER Q1'23 Launched 65391

Intel® Server Spares and Accessories

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Liquid-Cooling DIMM Clip and Mylar DNPLCDIMMCLIPM Q1'23 Launched 65445
Liquid-Cooling Loop DIMM TIMM DNPLCDMTM Q1'23 Launched 65446
Liquid-Cooling Loop DNPLCLPCM Q1'23 Launched 65448
Liquid-Cooling Loop PVC DNPLCLPAM (Accelerator Module) Q1'23 Launched 65449

Intel® Optane™ DC SSD Series

Product Name Capacity Form Factor Interface Sort Order Compare
All | None
Intel® Optane™ SSD P1600X Series (118GB, M.2 80mm PCIe 3.0 x4, 3D XPoint™) 118 GB M.2 22 x 80mm PCIe 3.0 x4, NVMe 54398
Intel® Optane™ SSD P1600X Series (58GB, M.2 80mm PCIe 3.0 x4, 3D XPoint™) 58 GB M.2 22 x 80mm PCIe 3.0 x4, NVMe 54400

Intel® Virtual RAID on CPU (Intel® VROC)

Product Name Sort Order Compare
All | None
Intel® Virtual RAID on CPU (Intel® VROC) Standard Software Key VROCSTANKEY 56220

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

BIOS and Firmware Update Package for UEFI for Intel® Server D50DNP Family

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BIOS and System Firmware Update Package (SFUP) for Windows* and Linux* for Intel® Server D50DNP Family

View Details

Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 741 Chipset

View Details

Onboard Video Driver for Linux* for Intel® Server Boards and Systems Based on Intel® 741 Chipset

View Details

Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 741 Chipset

View Details

Intel® Virtual RAID on CPU (Intel® VROC) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 741 Chipset

View Details

Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 741 Chipset

View Details

Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems

View Details

Server Information Retrieval Utility (SysInfo) for Intel® Server Boards and Intel® Server Systems

View Details

Server Firmware Update Utility(SysFwUpdt) for Intel® Server Boards and Intel® Server Systems

View Details
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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Intel® Optane™ Persistent Memory Supported

Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Intel® Optane™ Memory Supported ‡

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Find products with Intel® Remote Management Module Support

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Rapid Storage Technology enterprise

Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Intel® Total Memory Encryption

TME – Total Memory Encryption (TME) helps protect data against exposure via physical attack on memory, such as cold-boot attacks.

Intel® Software Guard Extensions (Intel® SGX)

Intel® Software Guard Extensions (Intel® SGX) provide applications the ability to create hardware enforced trusted execution protection for their applications’ sensitive routines and data. Intel® SGX provides developers a way to partition their code and data into CPU hardened trusted execution environments (TEE’s).

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.