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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® Optane™ SSD P1600X Series

118GB, M.2 80mm PCIe 3.0 x4, 3D XPoint™

Specifications

Export specifications

Essentials

Performance Specifications

Reliability

Package Specifications

Ordering and Compliance

Ordering and spec information

Intel® Optane™ SSD P1600X Series (118GB, M.2 80mm PCIe 3.0 x4, 3D XPoint™) Generic Single Pack

  • MM# 99AGG3
  • Ordering Code SSDPEK1A118GA01
  • MDDS Content IDs 706777

Intel® Optane™ SSD P1600X Series (118GB, M.2 80mm PCIe 3.0 x4, 3D XPoint™) Generic 100 Pack

  • MM# 99AJ1G
  • Ordering Code SSDPEK1A118GA
  • MDDS Content IDs 706777

Trade compliance information

  • ECCN 5A992C
  • CCATS 740.17B1
  • US HTS 8471706000

PCN Information

Compatible Products

Intel® Server D50DNP Family

Product Name Launch Date Marketing Status Board Form Factor Chassis Form Factor Socket Sort Order Compare
All | None
Intel® Server System D50DNP1MHCPAC Compute Module Q1'23 Discontinued 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62312
Intel® Server System D50DNP1MHCPLC Compute Module Q1'23 Discontinued 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62313
Intel® Server System D50DNP1MFALLC Acceleration Module Q1'23 Discontinued 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62314
Intel® Server System D50DNP1MHEVAC Compute Module Q1'23 Discontinued 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62315
Intel® Server System D50DNP2MHSVAC Management Module Q1'23 Discontinued 8.33” x 21.5” 2U Rack front IO Socket- E LGA4677 62316
Intel® Server System D50DNP2MFALAC Acceleration Module Q1'23 Discontinued 8.33” x 21.5” 2U Rack front IO Socket- E LGA4677 62317

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Intel® Memory and Storage Tool (GUI)

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Intel® Memory and Storage Tool CLI (Command-Line Interface)

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Intel® SSD Firmware Update Tool

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Support

Launch Date

The date the product was first introduced.

Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

Sequential Bandwidth - 100% Read (up to)

Speed with which the device is able to retrieve data that forms one contiguous, ordered block of data. Measured in MB/s (MegaBytes per Second)

Sequential Bandwidth - 100% Write (up to)

Speed with which the device is able to record data into one contiguous, ordered block of data. Measured in MB/s (MegaBytes per Second)

Random Read (100% Span)

Speed with which the SSD is able to retrieve data from arbitrary locations in the memory, across the entire span of the drive. Measured in IOPS (Input/Output Operations Per Second)

Random Write (100% Span)

Speed with which the SSD is able to record data to arbitrary locations in the memory, across the entire span of the drive. Measured in IOPS (Input/Output Operations Per Second)

Power - Active

Active Power indicates typical power consumption of the device when operating.

Power - Idle

Idle Power indicates typical power consumption of the device when idle.

Vibration - Operating

Operating Vibration indicates the tested capability of the SSD to withstand the reported vibration in the operating state and remain functional. Measured in G-force RMS (Root Mean Square)

Vibration - Non-Operating

Non-Operating Vibration indicates the tested capability of the SSD to withstand the reported vibration in the non-operating state and remain functional. Measured in G-force RMS (Root Mean Square)

Shock (Operating and Non-Operating)

Shock indicates the tested capability of the SSD to withstand the reported shock in both operating and non-operating states and remain functional. Measured in G-force (Max)

Max Operating Temperature

This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.

Endurance Rating (Lifetime Writes)

Endurance rating indicates the expected data storage cycles to be expected over the life of the device.

Mean Time Between Failures (MTBF)

MTBF (Mean Time Between Failures) indicates the expected elapsed operating time between failures. Measured in hours.

Uncorrectable Bit Error Rate (UBER)

Uncorrectable Bit Error Rate (UBER) indicates the number of uncorrectable bit errors divided by the total number of transferred bits during a tested time interval.

Warranty Period

Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.

Form Factor

Form factor indicates the industry standard size and shape of the device.

Interface

Interface indicates the industry standard bus communication method employed by the device.

Enhanced Power Loss Data Protection

Enhanced Power Loss Data Protection prepares the SSD for unexpected system power loss by minimizing data in transition in temporary buffers, and uses on-board power-loss protection capacitance to provide enough energy for the SSD firmware to move data from the transfer buffer and other temporary buffers to the NAND, thus protecting system and user data.

High Endurance Technology (HET)

High Endurance Technology (HET) in SSD's combines Intel® NAND Flash Memory silicon enhancements and SSD system management techniques to help extend the endurance of the SSD. Endurance is defined as the amount of data that can be written to an SSD during its lifetime.

Temperature Monitoring and Logging

Temperature Monitoring and Logging uses an internal temperature sensor to monitor and log airflow and device internal temperature. The logged results can be accessed using the SMART command.

End-to-End Data Protection

End-to-End Data Protection ensures integrity of stored data from the computer to the SSD and back.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.