CPU Carrier Clip

4th Gen Intel® Xeon® Scalable Processors AXXSPRHBMCC

Specifications

Supplemental Information

  • Description The processor carrier clip is a component within the processor heat sink module (PHM). It is used to attach the processor to the heat sink before the PHM is installed onto the processor socket on the server board.

Ordering and Compliance

Retired and discontinued

CPU Carrier Clip (4th Gen Intel® Xeon® Scalable Processors) AXXSPRHBMCC, Single

  • MM# 99ARX1
  • Ordering Code AXXSPRHBMCC
  • MDDS Content IDs 776064

Trade compliance information

  • ECCN EAR99
  • CCATS NA
  • US HTS 8473305100

PCN Information

Compatible Products

Intel® Server D50DNP Family

Product Name Launch Date Marketing Status Board Form Factor Chassis Form Factor Socket Sort Order Compare
All | None
Intel® Server System D50DNP1MHCPLC Compute Module Q1'23 Discontinued 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62313
Intel® Server System D50DNP1MFALLC Acceleration Module Q1'23 Discontinued 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62314
Intel® Server System D50DNP2MHSVAC Management Module Q1'23 Discontinued 8.33” x 21.5” 2U Rack front IO Socket- E LGA4677 62316
Intel® Server System D50DNP2MFALAC Acceleration Module Q1'23 Discontinued 8.33” x 21.5” 2U Rack front IO Socket- E LGA4677 62317

Drivers and Software

Latest Drivers & Software

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.