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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

CPU Carrier Clip

4th Gen Intel® Xeon® Scalable Processors AXXSPRXCCCC

Specifications

Export specifications

Essentials

Supplemental Information

  • Description The processor carrier clip is used to attach the processor to the heat sink before the PHM is installed onto the processor socket. The type of the processor carrier clips (E1A or E1C ) is defined by the processor SKU.

Ordering and Compliance

Ordering and spec information

CPU Carrier Clip (4th Gen Intel® Xeon® Scalable Processors) AXXSPRXCCCC, Single

  • MM# 99ARX0
  • Ordering Code AXXSPRXCCCC

Trade compliance information

  • ECCN EAR99
  • CCATS NA
  • US HTS 8473305100

PCN Information

Compatible Products

Intel® Server M50FCP Family

Product Name Launch Date Marketing Status Board Form Factor Chassis Form Factor Socket Sort Order Compare
All | None
Intel® Server System M50FCP2UR312 Q1'23 Launched 18.79” x 16.84” 2U Rack Socket-E LGA4677 61696
Intel® Server System M50FCP2UR208 Q1'23 Launched 18.79” x 16.84” 2U Rack Socket-E LGA4677 61697
Intel® Server System M50FCP1UR212 Q1'23 Launched 18.79” x 16.84” 1U Rack Socket-E LGA4677 61698
Intel® Server System M50FCP1UR204 Q1'23 Launched 18.79” x 16.84” 1U Rack Socket-E LGA4677 61699

Intel® Server D50DNP Family

Product Name Launch Date Marketing Status Board Form Factor Chassis Form Factor Socket Sort Order Compare
All | None
Intel® Server System D50DNP1MHCPAC Compute Module Q1'23 Launched 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62146
Intel® Server System D50DNP1MHCPLC Compute Module Q1'23 Launched 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62147
Intel® Server System D50DNP1MFALLC Acceleration Module Q1'23 Launched 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62148
Intel® Server System D50DNP1MHEVAC Compute Module Q1'23 Launched 8.33” x 21.5” 2U Front IO, 4 node Rack Socket- E LGA4677 62149
Intel® Server System D50DNP2MHSVAC Management Module Q1'23 Launched 8.33” x 21.5” 2U Rack front IO Socket- E LGA4677 62150
Intel® Server System D50DNP2MFALAC Acceleration Module Q1'23 Launched 8.33” x 21.5” 2U Rack front IO Socket- E LGA4677 62151

Intel® Server Board M50FCP

Product Name Marketing Status Board Form Factor Chassis Form Factor Socket TDP Sort Order Compare
All | None
Intel® Server Board M50FCP2SBSTD Launched 18.79” x 16.84” Rack Socket-E LGA4677 350 W 62631

Drivers and Software

Latest Drivers & Software

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.