Intel® Server System R2208WT2YSR

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Integrated Graphics ^‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

PCIe x8 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

PCIe x4 Gen 2.x

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Connector for Intel® I/O Expansion Module x8 Gen 3

IO expansion indicates a mezzanine connector on Intel® Server Boards that support a variety of Intel® I/O Expansion Modules using a PCI Express* interface. These modules typically have external ports that are accessed on the rear I/O panel.

Connector for Intel® Integrated RAID Module

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Integrated SAS Ports

Integrated SAS indicates Serial Attached SCSI (Small Computer System Interface) support integrated into the board. SAS is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

Embedded USB (eUSB) Solid State Drive Option

Embedded USB (Universal Serial Bus) supports small USB flash storage devices which can be plugged directly into the board, and can be used for mass storage or a boot device.

Integrated InfiniBand*

Infiniband is a switched fabric communications link used in high-performance computing and enterprise data centers.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

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Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

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Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

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Intel® Server Customization Technology

Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

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Intel® Build Assurance Technology

Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

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Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

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Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

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Intel® Virtualization Technology for Directed I/O (VT-d) ^‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

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