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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Xeon Phi™ Coprocessor 7120A

16GB, 1.238 GHz, 61 core

Specifications

Export specifications

Essentials

Performance Specifications

Supplemental Information

Expansion Options

Package Specifications

  • Bracket Height PCI bracket included or installed (not on Bulk), 312 mm

Advanced Technologies

Ordering and Compliance

Retired and discontinued

Intel® Xeon Phi™ Coprocessor 7120A (16GB, 1.238 GHz, 61 core) PCIe Card, Actively Cooled, PCIe Bracket Included

  • MM# 934878
  • Spec Code S
  • Ordering Code SC7120A
  • MDDS Content IDs 706221

Trade compliance information

  • ECCN 3A991
  • CCATS NA
  • US HTS 8471500150

PCN Information

S

Compatible Products

Intel® Server System R2000WT Family

Product Name Launch Date Marketing Status Board Form Factor Chassis Form Factor Socket Sort Order Compare
All | None
Intel® Server System R2208WTTYSR Q1'16 Discontinued Custom 16.7" x 17" 2U, Spread Core Rack Socket R3 61542
Intel® Server System R2208WT2YSR Q1'16 Discontinued Custom 16.7" x 17" 2U, Spread Core Rack Socket R3 61544
Intel® Server System R2208WTTYC1R Q1'16 Discontinued Custom 16.7" x 17" 2U, Spread Core Rack Socket R3 61546
Intel® Server System R2308WTTYSR Q1'16 Discontinued Custom 16.7" x 17" 2U, Spread Core Rack Socket R3 61548
Intel® Server System R2312WTTYSR Q1'16 Discontinued Custom 16.7" x 17" 2U, Spread Core Rack Socket R3 61550
Intel® Server System R2224WTTYSR Q1'16 Discontinued Custom 16.7" x 17" 2U, Spread Core Rack Socket R3 61553

Intel® Server Board S2600CW Family

Compare
All | None

Intel® Server Board S2600WT Family

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All | None

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Processor Number

The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Intel® Turbo Boost Technology ‡

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.

Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information and applicability of this technology.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.