Intel Server System D40AMP1MHCPAC Compute Module

1U Half-Width Air-Cooled

Specifications

  • Product Collection Intel® Server D40AMP Family
  • Code Name Products formerly American Pass
  • Launch Date Q4'21
  • Marketing Status Discontinued
  • Expected Discontinuance 31 DEC 2022
  • EOL Announce Monday, July 11, 2022
  • Last Order Wednesday, November 30, 2022
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Additional Extended Warranty Details Dual Processor Board Extended Warranty
  • Supported Operating Systems VMware ESXi* 7.0, Windows Server 2022*, Windows Server 2019*, Red Hat Enterprise Linux 8.4*, SUSE Linux Enterprise Server 15 SP3*
  • Chassis Form Factor Rack
  • Board Form Factor 8.33” x 21.5”
  • Compatible Product Series 3rd Generation Intel® Xeon® Scalable Processors
  • Socket Dual Socket-P4 4189
  • TDP 205 W
  • System Board Intel® Server Board D40AMP1SB
  • Target Market High Performance Computing
  • Rack-Friendly Board Yes
  • Included Items (1) 1U half-width module tray – iPN M28502-xxx
    (1) Intel® Server Board D40AMP1SB
    (1) 1U compute module airduct – iPN K61940-xxx
    (2) 1U low-profile PCIe* riser card –TNP1UCRRISER
    (2) 1U riser bracket to support TNP1UCRRISER- iPN K25206-xxx
    (1) 1U Air-Cooled front Heat Sink TNP1UHSF
    (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB
    (2) Processor carrier clip, for 3rd Gen Intel® Xeon® processor Scalable supported by D40AMP product family – iPN J98484-xxx
    (2) M.2 heatsink assembly TNPM2HS

Supplemental Information

  • Description 1U half-width compute module with the Intel® Server Board D40AMP at its heart and supporting the 3rd Gen Intel® Xeon® Scalable processors, it builds upon its features to provide support for internal storage, and PCIe* 4.0 expansion options

Memory & Storage

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Ordering and Compliance

Retired and discontinued

Intel Server System D40AMP1MHCPAC Compute Module (1U Half-Width Air-Cooled), Single

Trade compliance information

  • ECCN 5A002U
  • CCATS G157815L1
  • US HTS 8473305100

PCN Information

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Intel® Server Board D40AMP Family BIOS and System Firmware Update Package (SFUP) for Windows* and Linux*

Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems

Intel® Virtual RAID on CPU (Intel® VROC) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 621A Chipset

Intel® Server D40AMP Product Family Power Budget and Thermal Configuration Tool

Intel® Server Board D40AMP Family BIOS and Firmware Update Package for UEFI

Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset

Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Storage Profile

Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Intel® Optane™ Persistent Memory Supported

Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Quiet System Technology

Intel® Quiet System Technology can help reduce system noise and heat through more intelligent fan speed control algorithms.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.