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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® Server System D50TNP2MHSTAC Storage Module

Specifications

Export specifications

Essentials

  • Product Collection Intel® Server D50TNP Family
  • Code Name Products formerly Tennessee Pass
  • Marketing Status Discontinued
  • Launch Date Q3'21
  • Expected Discontinuance 2023
  • EOL Announce Friday, May 5, 2023
  • Last Order Friday, June 30, 2023
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Additional Extended Warranty Details Dual Processor Board Extended Warranty
  • Compatible Product Series 3rd Generation Intel® Xeon® Scalable Processors
  • Board Form Factor 8.33” x 21.5”
  • Chassis Form Factor 2U Rack
  • Socket Socket-P4
  • Integrated BMC with IPMI IPMI 2.0 & Redfish
  • Rack-Friendly Board Yes
  • TDP 205 W
  • Included Items (1) Intel® Server Board D50TNP1SB
    (1) 2U half-width module tray – iPN K74857
    (1) 1U storage module air duct right – iPN K88592
    (1) 1U storage module air duct left – iPN K88590
    (2) 1U riser bracket to support TNP1URISER – iPN K25206
    (2) M.2 heat sink assembly TNPM2HS
    (1) 1U Air-Cooled front Heat Sink TNP1UHSF
    (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB
    (2) Processor clip, for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484
    (1) Storage Compute Module Docking Board TNPSTDCKBRD
    (2) OCuLink cable 520 mm – iPN K73563
    (2) OCuLink cable 125 mm – iPN K73567
    (2) OCuLink cable 145 mm – iPN K73568
    (2) OCuLink cable 140 mm – iPN K73570
    (1 each) OCuLink connector covers for J25, J26, J29, and J30 – iPN K74231
    (1 each) OCuLink connector covers for J27 and J28 – iPN K74230
  • Board Chipset Intel® C621A Chipset
  • Target Market High Performance Computing

Supplemental Information

  • Embedded Options Available No
  • Description A 2U high-density Storage module integrated with the Intel® Server Board D50TNP1SB intended for dense and fast storage solutions, supports up to 16 EDSFF E1.L NVMe* SSDs.

Memory Specifications

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Ordering and Compliance

Ordering and spec information

Intel® Server System D50TNP2MHSTAC Storage Module , Single

  • MM# 99A27J
  • Ordering Code D50TNP2MHSTAC
  • MDDS Content IDs 790972

Trade compliance information

  • ECCN 5A002U
  • CCATS G157815L1
  • US HTS 8473305100

PCN Information

Compatible Products

3rd Gen Intel® Xeon® Scalable Processors

Compare
All | None

Intel® Server Board D50TNP

Product Name Marketing Status Board Form Factor Chassis Form Factor Socket TDP Sort Order Compare
All | None
Intel® Server Board D50TNP1SB Discontinued 8.33” x 21.5” Rack Socket-P4 270 W 62794
Intel® Server Board DDR4 D50TNP1SBCR Discontinued 8.33” x 21.5” Rack Socket-P4 270 W 62795

Intel® RAID Controllers

Compare
All | None

Management Module Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Advanced System Management key ADVSYSMGMTKEY Q1'21 Launched 64462
EMP Module AXXFCEMP Q3'19 Launched 64465
Trusted Platform Module 2.0 AXXTPMCHNE8 Q2'19 Launched 64489
Trusted Platform Module 2.0 AXXTPMENC8 Q3'17 Discontinued 64490

Spare Board Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Storage Compute Module Docking Board TNPSTDCKBRD Q2'21 Launched 64889

Spare Cable Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
I/O Breakout cable spare kit AXXCONNTDBG Q3'19 Launched 64915

Spare Drive Bays & Carrier Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Blank Ruler Filler TNPRLRBLNK Q2'21 Launched 65102

Spare Heat-Sink Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
1U Air-Cooled front Heat Sink TNP1UHSF Q2'21 Launched 65242
1U Air-Cooled Rear Heat Sink TNP1UHSB Q2'21 Launched 65245
Blank DIMM filler TNPDMMBLNK Q2'21 Launched 65252
M.2 Heat sink Assembly FXXWKM2HS Q3'19 Discontinued 65270

Spare Riser Card Options

Compare
All | None

Intel® Server Component Extended Warranty

Compare
All | None

100GbE Intel® Ethernet Network Adapter E810

Product Name Embedded Options Available Cabling Type Port Configuration Data Rate Per Port System Interface Type Sort Order Compare
All | None
Intel® Ethernet Network Adapter E810-CQDA2 for OCP 3.0 No QSFP28 ports - DAC, Optics, AOC's Dual 100/50/25/10GbE PCIe 4.0 (16 GT/s) 52108

Intel® Ethernet Network Adapter XXV710

Product Name Embedded Options Available Cabling Type Port Configuration Data Rate Per Port System Interface Type Sort Order Compare
All | None
Intel® Ethernet Network Adapter XXV710-DA2 No SFP28 Direct Attach twinaxial cabling up to 5m / SFP28 SR & LR Optics also supported Dual 25/10/1GbE PCIe 3.0 (8.0 GT/s) 52197

Intel® Ethernet Network Adapter X710

Compare
All | None

Intel® Ethernet Converged Network Adapter X550

Product Name Embedded Options Available Cabling Type Port Configuration Data Rate Per Port System Interface Type Sort Order Compare
All | None
Intel® Ethernet Converged Network Adapter X550-T2 No RJ45 Category 6 up to 55m; Category 6A up to 100m Dual 10GbE/5GbE/2.5GbE/1GbE/100Mb PCIe v3.0 (8.0 GT/s) 52343

Intel® Ethernet Server Adapter I350 Series

Product Name Embedded Options Available Cabling Type TDP Port Configuration System Interface Type Sort Order Compare
All | None
Intel® Ethernet Server Adapter I350-T4V2 No Cat 5 up to 100m 5 W Quad PCIe v2.1 (5.0 GT/s) 52529

Intel® Optane™ DC SSD Series

Product Name Capacity Form Factor Interface Sort Order Compare
All | None
Intel® Optane™ SSD DC P4801X Series (375GB, M.2 110MM PCIe x4, 3D XPoint™) 375 GB M.2 22 x 110mm PCIe 3.0 x4, NVMe 54503
Intel® Optane™ SSD DC P4801X Series (200GB, M.2 110MM PCIe x4, 3D XPoint™) 200 GB M.2 22 x 110mm PCIe 3.0 x4, NVMe 54506
Intel® Optane™ SSD DC P4801X Series (100GB, M.2 110MM PCIe x4, 3D XPoint™) 100 GB M.2 22 x 110mm PCIe 3.0 x4, NVMe 54524

Intel® Optane™ Persistent Memory 200 Series

Product Name Capacity Form Factor Interface Sort Order Compare
All | None
Intel® Optane™ Persistent Memory 200 Series (512GB PMEM) Module 512 GB Persistent Memory Module (PMem) DDR-T 55904
Intel® Optane™ Persistent Memory 200 Series (256GB PMEM) Module 256 GB Persistent Memory Module (PMem) DDR-T 55907
Intel® Optane™ Persistent Memory 200 Series (128GB PMEM) Module 128 GB Persistent Memory Module (PMem) DDR-T 55910

Intel® Virtual RAID on CPU (Intel® VROC)

Product Name Sort Order Compare
All | None
Intel® Virtual RAID on CPU (Intel® VROC) - Standard 56222
Intel® Virtual RAID on CPU (Intel® VROC) - Premium 56224

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset

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Intel® Server Board D50TNP Family BIOS and System Firmware Update Package (SFUP) for Windows* and Linux*

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Intel® Server Board D50TNP Family BIOS and Firmware Update Package for UEFI

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Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset

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Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems

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Intel® Virtual RAID on CPU (Intel® VROC) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 621A Chipset

View Details

Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) for Linux*

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Onboard Network Driver for Linux* for Intel® Server System S9200WK Family

View Details

Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 621A Chipset

View Details

Intel® Virtual RAID on CPU (Intel® VROC) Linux* Driver for Intel® Server Boards and Systems Based on Intel® 621A Chipset

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Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) Mount Clean Script

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Onboard Video Driver for Linux* for Intel® Server Boards and Systems Based on Intel® 621A Chipset

View Details

Intel® Server System D50TNP Product Family Power Budget and Thermal Configuration Tool

View Details

Intel® Configuration Detector for Linux*

View Details
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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Intel® Optane™ Persistent Memory Supported

Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

PCIe OCuLink Connectors (NVMe support)

Onboard PCIe OCuLink connectors provide direct-attach NVMe SSD support.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Optane™ Memory Supported ‡

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.