Intel® Server Board D50TNP1SB

Specifications

  • Product Collection Intel® Server Board D50TNP Family
  • Code Name Products formerly Tennessee Pass
  • Status Launched
  • Launch Date Q2'21
  • Expected Discontinuance 2025
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Compatible Product Series 3rd Generation Intel® Xeon® Scalable Processors
  • Board Form Factor 8.33” x 21.5”
  • Chassis Form Factor Rack
  • Socket Socket-P4
  • Integrated BMC with IPMI IPMI 2.0 & Redfish
  • Rack-Friendly Board Yes
  • TDP 270 W
  • Included Items (1) Intel® Server Board D50TNP1SB
    (24) DIMM slots with supports for standard DDR4 and Intel® Optane™ persistent memory 200 series
    (8) PCIe* NVMe* OCuLink connectors
    (2) Processor carrier clip, for 3rd Gen Intel® Xeon® Scalable processor family supported by D50TNP product family – iPN J98484-xxx
    (9) Heat sinks for voltage regulators

  • Board Chipset Intel® C621A Chipset
  • Target Market High Performance Computing

Supplemental Information

  • Embedded Options Available No
  • Description A high-density half-width server board supporting two 3rd Generation Intel® Xeon® Processor Scalable Family and designed to serve compute, management, storage, and acceleration needs.

Memory Specifications

Processor Graphics

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Advanced Technologies

Intel® Transparent Supply Chain

Ordering and Compliance

Ordering and spec information

Intel® Server Board D50TNP1SB, Single

  • MM# 99A2AT
  • Ordering Code D50TNP1SB

Trade compliance information

  • ECCN 5A002U
  • CCATS G157815L1
  • US HTS 8473301180

Compatible Products

3rd Generation Intel® Xeon® Scalable Processors

Product Name Status Launch Date # of Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® Platinum 8380 Processor Launched Q2'21 40 3.40 GHz 2.30 GHz 60 MB 270 W 7
Intel® Xeon® Platinum 8368 Processor Launched Q2'21 38 3.40 GHz 2.40 GHz 57 MB 270 W 105
Intel® Xeon® Platinum 8362 Processor Launched Q2'21 32 3.60 GHz 2.80 GHz 48 MB 265 W 132
Intel® Xeon® Platinum 8360Y Processor Launched Q2'21 36 3.50 GHz 2.40 GHz 54 MB 250 W 138
Intel® Xeon® Platinum 8358P Processor Launched Q2'21 32 3.40 GHz 2.60 GHz 48 MB 240 W 153
Intel® Xeon® Platinum 8358 Processor Launched Q2'21 32 3.40 GHz 2.60 GHz 48 MB 250 W 156
Intel® Xeon® Platinum 8352Y Processor Launched Q2'21 32 3.40 GHz 2.20 GHz 48 MB 205 W 178
Intel® Xeon® Platinum 8352V Processor Launched Q2'21 36 3.50 GHz 2.10 GHz 54 MB 195 W 181
Intel® Xeon® Platinum 8352S Processor Launched Q2'21 32 3.40 GHz 2.20 GHz 48 MB 205 W 184
Intel® Xeon® Platinum 8352M Processor Launched Q2'21 32 3.50 GHz 2.30 GHz 48 MB 185 W 186
Intel® Xeon® Platinum 8351N Processor Launched Q2'21 36 3.50 GHz 2.40 GHz 54 MB 225 W 188
Intel® Xeon® Gold 6354 Processor Launched Q2'21 18 3.60 GHz 3.00 GHz 39 MB 205 W 225
Intel® Xeon® Gold 6348 Processor Launched Q2'21 28 3.50 GHz 2.60 GHz 42 MB 235 W 233
Intel® Xeon® Gold 6346 Processor Launched Q2'21 16 3.60 GHz 3.10 GHz 36 MB 205 W 236
Intel® Xeon® Gold 6342 Processor Launched Q2'21 24 3.50 GHz 2.80 GHz 36 MB 230 W 238
Intel® Xeon® Gold 6338T Processor Launched Q2'21 24 3.40 GHz 2.10 GHz 36 MB 165 W 241
Intel® Xeon® Gold 6338N Processor Launched Q2'21 32 3.50 GHz 2.20 GHz 48 MB 185 W 242
Intel® Xeon® Gold 6338 Processor Launched Q2'21 32 3.20 GHz 2.00 GHz 48 MB 205 W 245
Intel® Xeon® Gold 6336Y Processor Launched Q2'21 24 3.60 GHz 2.40 GHz 36 MB 185 W 247
Intel® Xeon® Gold 6334 Processor Launched Q2'21 8 3.70 GHz 3.60 GHz 18 MB 165 W 251
Intel® Xeon® Gold 6330N Processor Launched Q2'21 28 3.40 GHz 2.20 GHz 42 MB 165 W 254
Intel® Xeon® Gold 6330 Processor Launched Q2'21 28 3.10 GHz 2.00 GHz 42 MB 205 W 260
Intel® Xeon® Gold 6326 Processor Launched Q2'21 16 3.50 GHz 2.90 GHz 24 MB 185 W 269
Intel® Xeon® Gold 6314U Processor Launched Q2'21 32 3.40 GHz 2.30 GHz 48 MB 205 W 272
Intel® Xeon® Gold 6312U Processor Launched Q2'21 24 3.60 GHz 2.40 GHz 36 MB 185 W 274
Intel® Xeon® Gold 5320T Processor Launched Q2'21 20 3.50 GHz 2.30 GHz 30 MB 150 W 277
Intel® Xeon® Gold 5320 Processor Launched Q2'21 26 3.40 GHz 2.20 GHz 39 MB 185 W 283
Intel® Xeon® Gold 5318Y Processor Launched Q2'21 24 3.40 GHz 2.10 GHz 36 MB 165 W 287
Intel® Xeon® Gold 5318S Processor Launched Q2'21 24 3.40 GHz 2.10 GHz 36 MB 165 W 290
Intel® Xeon® Gold 5318N Processor Launched Q2'21 24 3.40 GHz 2.10 GHz 36 MB 150 W 293
Intel® Xeon® Gold 5317 Processor Launched Q2'21 12 3.60 GHz 3.00 GHz 18 MB 150 W 300
Intel® Xeon® Gold 5315Y Processor Launched Q2'21 8 3.60 GHz 3.20 GHz 12 MB 140 W 303
Intel® Xeon® Silver 4316 Processor Launched Q2'21 20 3.40 GHz 2.30 GHz 30 MB 150 W 306
Intel® Xeon® Silver 4314 Processor Launched Q2'21 16 3.40 GHz 2.40 GHz 24 MB 135 W 310
Intel® Xeon® Silver 4310T Processor Launched Q2'21 10 3.40 GHz 2.30 GHz 15 MB 105 W 314
Intel® Xeon® Silver 4310 Processor Launched Q2'21 12 3.30 GHz 2.10 GHz 18 MB 120 W 317
Intel® Xeon® Silver 4309Y Processor Launched Q2'21 8 3.60 GHz 2.80 GHz 12 MB 105 W 321

Intel® Server System D50TNP Family

Product Name Launch Date Status Board Form Factor Chassis Form Factor Socket Sort Order Compare
All | None
Intel® Server System D50TNP1MHCPAC Compute Module Q2'21 Launched 8.33” x 21.5” Rack Socket-P4 54673
Intel® Server System D50TNP2MHSVAC Management Module Q2'21 Launched 8.33” x 21.5” 2U Rack Socket-P4 54707
Intel® Server System D50TNP2MHSTAC Storage Module Q3'21 Launched 8.33” x 21.5” 2U Rack Socket-P4 54710
Intel® Server System D50TNP2MFALAC Acceleration Module Q2'21 Launched 8.33” x 21.5” 2U Rack Socket-P4 54714

Intel® Virtual RAID on CPU (Intel® VROC)

Compare
All | None

Management Module Options

Product Name Status Sort Order Compare
All | None
Trusted Platform Module 2.0 AXXTPMCHNE8 Launched 56857
Trusted Platform Module 2.0 AXXTPMENC8 Launched 56858

Spare Cable Options

Product Name Status Sort Order Compare
All | None
I/O Breakout cable spare kit AXXCONNTDBG Launched 57163

Spare Heat-Sink Options

Product Name Status Sort Order Compare
All | None
Blank DIMM filler TNPDMMBLNK Launched 57474

Spare Riser Card Options

Product Name Status Sort Order Compare
All | None
2U PCIe Riser (Two x16 PCIe slots, M.2 Connector and U.2 Connector) TNP2URISER Launched 57630

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset

Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) for Windows*

Intel® Server System D50TNP Product Family Power Budget and Thermal Configuration Tool

Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset

Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 621A Chipset

Intel® Virtual RAID on CPU (Intel® VROC) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 621A Chipset

Intel® Configuration Detector for Linux*

Intel® Server Debug and Provisioning Tool (Intel® SDP Tool)

Intel® SNMP Subagent Stand-Alone Intel® Server Management Utility for Intel® Server Boards and Systems Based on Intel® 62X Chipset

System Firmware Update Utility(SysFwUpdt) for Intel® Server Boards and Intel® Server Systems Based on Intel® 621A Chipset

Save and Restore System Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems Based on Intel® 621 A Chipset

System Information Retrieval Utility (SysInfo) for Intel® Server Boards and Intel® Server Systems Based on Intel® 621 A Chipset

Technical Documentation

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Intel® Optane™ Persistent Memory Supported

Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe OCuLink Connectors (NVMe support)

Onboard PCIe OCuLink connectors provide direct-attach NVMe SSD support.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.