Intel® Server System R1304SPOSHORR
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® Server System R1000SPO Family
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Code Name
Products formerly Silver Pass
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Launch Date
Q1'17
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Marketing Status
Discontinued
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Expected Discontinuance
Q3'20
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EOL Announce
Sunday, June 30, 2019
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Last Order
Sunday, July 5, 2020
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Last Receipt Attributes
Monday, October 5, 2020
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Limited 3-year Warranty
Yes
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Extended Warranty Available for Purchase (Select Countries)
Yes
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Additional Extended Warranty Details
Single Processor System Extended Warranty
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Chassis Form Factor
1U Rack
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Chassis Dimensions
17.26"x23.84"x1.7" (WxDxH)
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Board Form Factor
uATX
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Rack Rails Included
No
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Compatible Product Series
Intel® Xeon® Processor E3-1200 v5 Family
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Socket
LGA 1151 Socket H4
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TDP
80 W
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Heat Sink
F1UE3PASSHS
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Heat Sink Included
Yes
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System Board
Intel® Server Board S1200SP Family
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Board Chipset
Intel® C236 Chipset
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Target Market
Entry
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Rack-Friendly Board
Yes
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Power Supply
450 W
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Power Supply Type
AC
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# of Power Supply Included
2
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Redundant Fans
No
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Redundant Power Supported
Yes
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Backplanes
Included
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Included Items
(1) Intel® Server Board S1200SPOR, (1) Riser card assembly (AXX1UPCIEX16R2), (2) 450W redundant power supply, (1) Power Distribution Board, (4) 3.5 inch Hot-swap drive bays with (4) 3.5 inch Hot-swap drive trays (FXX35HSCAR), and (1) 12Gb SAS Backplane (FR1304S3HSBP), (1) SATA data cable, (1) Backplane 12C cable, (1) SATA ODD data cable, (1) SAS Data cable, (3) System fans, (1) Standard control panel assembly, (1) Front Q/O Pannel assembly (1 x VGA & 2 x USB), (1) SATA Optical drive bay with filler panel, (2) Chassis handles -installed
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Supplemental Information
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Description
Intel® Server System R1304SPOSHORR
1U rack system with S1200SPOR board and 4 x 3.5 hot-swapable HDD
Drive cage, 2 x 450W redundant power supplies.
Supporting one Intel® Xeon® Processor E3-1200 v5 & v6 family
Memory & Storage
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Memory Types
DDR4 ECC UDIMM
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# of Memory Slots
4
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Max Memory Size (dependent on memory type)
64 GB
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DIMM Type
UDIMM
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# of Front Drives Supported
4
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Front Drive Form Factor
Hot-swap 3.5" HDD or 2.5" SSD
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# of Internal Drives Supported
1
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Internal Drive Form Factor
M.2 SSD
GPU Specifications
Expansion Options
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Connector for Intel® I/O Expansion Module x8 Gen 3
1
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Connector for Intel® Integrated RAID Module
1
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Riser Slot 1: Total # of Lanes
8
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Riser Slot 1: Included Slot Configuration(s)
1x PCIe Gen3 x8
I/O Specifications
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# of USB Ports
9
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Total # of SATA Ports
8
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RAID Configuration
Software RAID RSTe (0,1,10,5) and ESRT2 (0,1,10)
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# of Serial Ports
1
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Integrated LAN
i210
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# of LAN Ports
2
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Optical Drive Support
Yes
Package Specifications
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Max CPU Configuration
1
Advanced Technologies
Ordering and Compliance
Compatible Products
Intel® Xeon® Processor E3 v6 Family
Intel® Xeon® Processor E3 v5 Family
Intel® Server Board S1200SP Family
Intel® Integrated RAID (Modules/System Boards)
Intel® RAID Controllers
Intel® RAID Software
Cable Options
I/O Options
Management Module Options
Optical/Floppy Drive Options
Rail Options
Riser Card Options
Spare Cable Options
Spare Chassis Maintenance Options
Spare Drive Bays & Carrier Options
Spare Fan Options
Spare Heat-Sink Options
Spare Power Options
Intel® Server Component Extended Warranty
Intel® Ethernet Network Adapter X710
Intel® Ethernet Converged Network Adapter X550
Intel® Ethernet Server Adapter I350 Series
Intel® Data Center Manager
Drivers and Software
Description
Type
More
OS
Version
Date
All
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Latest Drivers & Software
Name
Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) for Linux*
Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 23X Chipset
Intel® Server Board S1200SP BIOS and Firmware Update Package for EFI
Intel® Virtual RAID on CPU (Intel® VROC SATA)/Intel® Rapid Storage Technology Enterprise (Intel® RSTe) Windows* Driver for S1200SP Family
Intel® Configuration Detector for Linux*
Onboard Video Driver for Windows* Server 2016 for Intel® Server Boards and Systems Based on Intel® 23X Chipset
Intel® Server Board S1200SP BIOS and Firmware Update for Intel® One Boot Flash Update (Intel® OFU) Utility and WinPE*
Intel® Software Guard Extensions (Intel® SGX) Driver for Windows*
Intel® Embedded Server RAID Technology 2 (ESRT2) Linux* Driver for S1200SP Family
Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 23X Chipset
Intel® Embedded Server RAID Technology 2 (ESRT2) Windows* Driver for S1200SP Family
Intel® Server Board S1200SPO/S1200SPOR Firmware Update Package for EFI with Intel® Software Guard Extensions Support
EFI Platform Confidence Test Utility for Intel® Server Board S1200SP Family (for Test Use Only; no Technical Support)
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Connector for Intel® I/O Expansion Module x8 Gen 3
IO expansion indicates a mezzanine connector on Intel® Server Boards that support a variety of Intel® I/O Expansion Modules using a PCI Express* interface. These modules typically have external ports that are accessed on the rear I/O panel.
Connector for Intel® Integrated RAID Module
Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.
Riser Slot 1: Included Slot Configuration(s)
This is the configuration of the installed riser card for this specific slot for systems that ship with risers pre-installed.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
# of LAN Ports
LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Rapid Storage Technology enterprise
Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.
Intel® I/O Acceleration Technology
Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.
TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.