Intel® C236 Chipset
Specifications
Compare Intel® Products
Essentials
-
Product Collection
Intel® C230 Series Chipsets
-
Code Name
Products formerly Skylake
-
Vertical Segment
Server
-
Marketing Status
Launched
-
Launch Date
Q4'15
-
Bus Speed
8 GT/s
-
Lithography
22 nm
-
TDP
6 W
-
Supports Overclocking
No
-
Use Conditions
Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet
Sign in with your CNDA account to view additional SKU details.
Supplemental Information
Memory Specifications
GPU Specifications
-
# of Displays Supported ‡
3
Expansion Options
-
PCI Support
No
-
PCI Express Revision
3.0
-
PCI Express Configurations ‡
x1, x2, x4
-
Max # of PCI Express Lanes
20
I/O Specifications
-
# of USB Ports
14
-
USB Revision
3.0/2.0
-
USB 3.0
Up to 10
-
USB 2.0
4
-
Max # of SATA 6.0 Gb/s Ports
8
-
RAID Configuration
0/1/5/10
-
Integrated LAN
Integrated MAC
-
Supported Processor PCI Express Port Revision
3
-
Supported Processor PCI Express Port Configurations
1x16, 2x8, 1x8+2x4
Package Specifications
-
Package Size
23mm x 23mm
Advanced Technologies
-
Intel® Optane™ Memory Supported ‡
Yes
-
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
-
Intel® ME Firmware Version
11.0
-
Intel® Rapid Storage Technology
Yes
-
Intel® Rapid Storage Technology enterprise
Yes
-
Intel® Node Manager
Yes
-
Intel® Standard Manageability
Yes
-
Intel® Smart Response Technology
Yes
Security & Reliability
-
Intel vPro® Eligibility ‡
Intel vPro® Platform
-
Intel® Trusted Execution Technology ‡
Yes
Ordering and Compliance
Sign in with your CNDA account to view additional SKU details.
Ordering and spec information
Trade compliance information
- ECCN 5A992CN3
- CCATS G147881
- US HTS 8542310001
Drivers and Software
Description
Type
More
OS
Version
Date
All
View Details
Download
No results found for
Y
/apps/intel/arksuite/template/arkProductPageTemplate
Latest Drivers & Software
Launch Date
The date the product was first introduced.
Bus Speed
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Supports Overclocking
Overclocking indicates the ability to achieve high core, graphics and memory frequencies by independently raising processor clock speeds without impacting other system components.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
# of DIMMs per channel
DIMMs per Channel indicates the quantity of dual inline memory modules supported per each processor memory channel
PCI Support
PCI support indicates the type of support for the Peripheral Component Interconnect standard
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Supported Processor PCI Express Port Revision
Revision indicates the PCI express specification to which the processor port is enabled. Note: The processor's actual PCI express revision will be determined or limited by the value of this chipset attribute, even if the processor is designed to a higher revision.
Supported Processor PCI Express Port Configurations
Configurations indicates the number of lanes and bifurcation capabilities for which the processor PCI express port is enabled. Note: The processor's actual PCI express configurations will be determined or limited by the value of this chipset attribute even if the processor is capable of additional configurations.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® ME Firmware Version
Intel® Management Engine Firmware (Intel® ME FW) uses built-in platform capabilities and management and security applications to remotely manage networked computing assets out-of-band.
Intel® Rapid Storage Technology
Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.
Intel® Rapid Storage Technology enterprise
Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Standard Manageability
Intel® Standard Manageability is a base set of manageability features, including: Boot Control, Power State Management, HW Inventory, Serial Over LAN, and Remote Configuration.
Intel® Smart Response Technology
Intel® Smart Response Technology combines the fast performance of a small solid state drive with the large capacity of a hard disk drive.
Intel vPro® Eligibility ‡
The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability, and platform stability. The launch of 12th Gen Intel® Core™ processors introduced Intel vPro® Enterprise and Intel vPro® Essentials branding.
- Intel vPro® Enterprise: Commercial platform offering the full set of security, manageability, and stability features for any given Intel processor generation, including Intel® Active Management Technology
- Intel vPro® Essentials: Commercial platform offering a subset of Intel vPro® Enterprise features, including Intel® Hardware Shield and Intel® Standard Manageability
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel® Standard Manageability requires activation and a system with a corporate network connection, an Intel® ME Firmware-enabled chipset, network hardware and software. For notebooks, Intel® ME Firmware may be unavailable or limited over a host OS-based VPN, when connecting wirelessly, on battery power, sleeping, hibernating or powered off. Results dependent upon hardware, setup & configuration. For more information, visit http://www.intel.com/technology/platform-technology/intel-amt
WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit http://www.intel.com/content/www/us/en/gaming/overclocking/overclocking-intel-processors.html
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Intel® Smart Response Technology requires a select Intel® Core™ processor, an enabled chipset, Intel® Rapid Storage Technology software, and a properly configured hybrid drive (HDD + small SSD). Depending on system configuration, your results may vary. Contact your system manufacturer for more information.