Products Home Product Specifications Servers
Compare

  • Search examples

  • You can search our catalog of processors and other products in several ways.

  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® Server Chassis H2224XXLR3

Specifications

Export specifications

Essentials

  • Product Collection Intel® Server Chassis H2000P Family
  • Code Name Products formerly Buchanan Pass
  • Launch Date Q3'17
  • Marketing Status Discontinued
  • Expected Discontinuance 2023
  • EOL Announce Friday, May 5, 2023
  • Last Order Friday, June 30, 2023
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Chassis Form Factor 2U, 4 node Rack Chassis
  • Chassis Dimensions 3.46" x 17.24" x 28.86"
  • Target Market High Performance Computing
  • Power Supply 2130 W
  • Power Supply Type AC
  • # of Power Supply Included 2
  • Redundant Fans No
  • Redundant Power Supported Yes
  • Backplanes Included
  • TDP 140 W
  • Included Items (1) Front Control Panels - iPC FH2000FPANEL2 (1) Power Distribution Board - iPC FXXCRPSPDB2 Power Interposer Board - iPC FXXCRPSPIB (2) 2130W 80 Plus Platinum PSUs – iPC FXX2130PCRPS(1) 24 x 2.5’’ Hot-swap drive bay, includes:- (24) Tool less drive carriers (1) 24x2.5” Hot swap backplane, iPC- HW24X25HS12G (4) - Compute Module Bay Fillers(1) - Basic rack rail mount kit (AXXELVRAIL)NOTE: The rail kit only supports specific rack type with 3/8” square and 7.1mm round holes.
  • New Design Availability Expiration Date Monday, July 11, 2022

Supplemental Information

  • Description 2U rack chassis supporting up to four hot-pluggable compute modules Intel(r) Compute Module HNS2600BP*24 product family, up to 24 hot-swap drives, and two 2130W common redundant power supplies

Memory & Storage

  • # of Front Drives Supported 24
  • Front Drive Form Factor Hot-swap 2.5"

Package Specifications

  • Max CPU Configuration 8

Ordering and Compliance

Retired and discontinued

Intel® Server Chassis H2224XXLR3, Single

  • MM# 948907
  • Ordering Code H2224XXLR3
  • MDDS Content IDs 708833

Trade compliance information

  • ECCN 4A994
  • CCATS NA
  • US HTS 8473305100

PCN Information

Compatible Products

Intel® Server System S2600BPR Family

Compare
All | None

Bezel Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
2U Bezel A2UBEZEL Q2'12 Discontinued 64019

Rail Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
2/4U Premium Rail AXXFULLRAIL (with CMA support) Q2'15 Launched 64573
Enhanced Value RAIL AXXELVRAIL Q3'12 Launched 64629

Spare Board Options

Compare
All | None

Spare Chassis Control Panel Options

Compare
All | None

Spare Drive Bays & Carrier Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
2.5 inch Hot-swap Drive Carrier FXX25HSCAR2 Q3'14 Discontinued 65064
3.5 inch Tool Less Hot-Swap Drive Carrier FXX35HSCAR2 Q3'17 Launched 65091
Spare 12Gb SAS/SATA 24 x 2.5’’ Backplane Kit (with BIB) FHW24X25HSBP Q3'17 Launched 65132
Spare 12GB SAS 24 x 2.5’’ Backplane FHW24X25HS12G Q3'15 Discontinued 65142

Spare Fan Options

Compare
All | None

Spare Power Options

Compare
All | None

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Page / View All

Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Need more help?

Contact support

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.