The date the product was first introduced.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
A baseband processor is the chip in mobile phones that performs signal processing of the mobile functions.
Baseband functions refers to the mobile telephony protocols supported by the baseband processor.
An RF transceiver is a chip that transmits and receives a high frequency radio signal.
RF transceiver functions refers to the mobile telephony protocols supported by the RF transceiver.
Protocol stack is the software implementation of a networking protocol suite that defines the communication between each layer of the network
Baseband package size indicates the physical dimensions of the baseband processor
Transceiver package size indicates the physical dimensions of the RF transceiver
Pre Active: Orders may be taken, but not scheduled, nor shipped.
Active: This specific part is active.
End of Life: Product End of Life notification has been published.
Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.
Retired: This specific part is no longer being manufactured or purchased and no inventory is available.
No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.
Obsolete: Inventory available. No future supplies will be available.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
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