Intel® Compute Module MFS5520VIR

Specifications

  • Product Collection Intel® Compute Module MFS5000VI Family
  • Code Name Products formerly Victor Island
  • Marketing Status Discontinued
  • Launch Date Q2'09
  • Expected Discontinuance Q1'13
  • EOL Announce Sunday, March 31, 2013
  • Last Order Friday, November 1, 2013
  • Last Receipt Attributes Sunday, March 30, 2014
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • # of QPI Links 2
  • Compatible Product Series 39565, 47915
  • Board Form Factor 1U
  • Chassis Form Factor Rack or Pedestal
  • Socket LGA1366
  • Integrated BMC with IPMI IPMI 2.0
  • TDP 95 W
  • Included Items (1) Intel Compute Module based on the Intel® 5520 Chipset I/O Hub (IOH) and the Intel® 82801JR ICH10 RAID (Note: Requires installation in a system chassis at UFU V10.3 or V6.6 or higher to operate correctly)
  • Board Chipset Intel® 5520 I/O Hub
  • Target Market Small and Medium Business
  • New Design Availability Expiration Date Friday, August 1, 2014

Supplemental Information

  • Description Intel Compute Module based on the Intel® 5520 Chipset I/O Hub (IOH) and the Intel® 82801JR ICH10 RAID (Note: Requires installation in a system chassis at UFU V10.3 or V6.6 or higher to operate correctly)

Memory Specifications

GPU Specifications

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Security & Reliability

Ordering and Compliance

Retired and discontinued

Intel® Compute MFS5520VI, Single

Intel® Compute MFS5520VIB, 3 Pack

Intel® Compute MFS5520VI, Single

Intel® Compute MFS5520VIB, 3 Pack

Trade compliance information

  • ECCN 5A992C
  • CCATS G135162
  • US HTS 8473301180

PCN Information

Drivers and Software

Latest Drivers & Software

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Name

Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

# of QPI Links

QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.