Intel® Server System  MXN1208WFAFS2

Intel® Server System MXN1208WFAFS2

Specifications

  • Product Collection Intel® Data Center Blocks for Cloud (Intel® DCB for Cloud)
  • Code Name Products formerly Wolf Pass
  • Launch Date Q3'18
  • Status Launched
  • Expected Discontinuance Q3'19
  • Limited 3-year Warranty Yes
  • Chassis Form Factor 1U, Spread Core Rack
  • Chassis Dimensions 16.93" x 27.95" x 1.72"
  • Socket Socket P
  • TDP 85 W
  • Heat Sink (2) Passive 1U CPU heat sinks FXXCA78X108HS
  • Heat Sink Included Yes
  • System Board Intel® Server Board S2600WFT
  • Board Chipset Intel® C624 Chipset
  • Target Market Cloud/Datacenter
  • Rack-Friendly Board Yes
  • Power Supply 1100 W
  • Power Supply Type AC
  • # of Power Supply Included 2
  • Redundant Fans Yes
  • Redundant Power Supported Yes
  • Backplanes Included
  • Included Items (1) Intel® Server Chassis R1208WFTYS (8x2.5" Drives)

    (2) Intel® Xeon® Silver 4116 Processor (12 Cores, 2.1 GHz, 85 W )

    (12) RDIMM 16GB - DDR4, 288-pin, 2666MHz

    (1) Intel® RAID Controller RS3UC080

    (1) Intel® Ethernet Network Connection OCP X527-DA2

    (1) Remote Management Module Lite 2 AXXRMM4LITE2
  • Recommended Customer Price N/A

Supplemental Information

  • Description All-Flash with Intel® SSDs, 32 Cores, 12.6TB raw capacity, 192GB memory

Memory & Storage

  • Storage Profile All-Flash Storage Profile
  • Included Memory 12x16GB DDR4, 288-pin, 2666MHz
  • Memory Types RDIMM 16GB - DDR4, 288-pin, 2666MHz
  • Max # of DIMMs 24
  • Included Storage (6) Intel® SSD D3-S4510 Series (1.9TB), (1) Intel® SSD D3-S4510 Series (240GB), (1) Intel® SSD D3-S4610 Series (960GB)
  • # of Front Drives Supported 8
  • Front Drive Form Factor Hot-swap 2.5"

Processor Graphics

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Product Images

Intel® Server Board S2600WF-Based Systems featuring Intel® Xeon® Scalable processors 8×25 image_angle

Ordering and Compliance

Ordering and spec information

Intel® Server System MXN1208WFAFS2, Single

  • Ordering Code MXN1208WFAFS2

Trade compliance information

  • ECCN5A002U
  • CCATSG157815L1
  • US HTS8471500150

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Recommended Customer Price

Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.

Storage Profile

Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.

Included Memory

Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

PCIe x8 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization techology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Build Assurance Technology

Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Rapid Storage Technology enterprise

Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® I/O Acceleration Technology

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

QR

Quality/Reliability Hold.

RS

Reschedule

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

E2

Obsolete and past last time buy.

BR

Bookings Release (BR) – Product can be booked but not shipped.

NI

Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.

Boxed Processor

Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

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