Intel® Aero Compute Board
Specifications
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Essentials
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Product Collection
Intel® Aero Products
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Supported Operating Systems
Linux*
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New Design Availability Expiration Date
Monday, August 16, 2021
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Supplemental Information
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Marketing Status
Discontinued
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Launch Date
Q3'16
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Description
This purpose-built, UAV developer kit, powered by a quad-core Intel® Atom™ processor, combines compute, storage, communications, and flexible I/O—all in a form-factor the size of a standard playing card.
Memory & Storage
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Included Memory
4GB
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Memory Types
LPDDR3-1600
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Internal Drive Form Factor
M.2 SSD
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Embedded Storage
32 GB
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Removable Memory Card Slot
MicroSD
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M.2 Card Slot (storage)
Yes
I/O Specifications
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# of USB Ports
1
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USB Revision
3.0 OTG
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Integrated Wireless‡
Intel® Dual Band Wireless-AC 8260; 802.11ac
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M.2 Card Slot (wireless)
Yes
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Additional Headers
An I/O expansion connector exposes 34 GPIOs (3.3V) and 5 analog inputs (0 - 3V) programmable via the Intel Atom processor and Altera Max 10 FPGA. Also available are 1 HSUART and 1 CAN bus.
Package Specifications
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TDP
10 W
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DC Input Voltage Supported
5 - 20V
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Board Form Factor
88mm x 63mm x 20mm
Ordering and Compliance
Drivers and Software
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Launch Date
The date the product was first introduced.
Included Memory
Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Embedded Storage
Embedded Storage indicates the presence and size of onboard storage capacity that is built into the board, in addition to any drives that could be added via other interfaces.
Removable Memory Card Slot
Removable Card Slot indicates the presence of a slot for removable memory cards.
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
M.2 Card Slot (wireless)
M.2 Card Slot (wireless) indicates presence of an M.2 slot that's keyed for wireless expansion cards
Additional Headers
Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.