Intel Atom® x3-C3265RK Processor
Specifications
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Essentials
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Product Collection
Intel Atom® Processor X Series
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Code Name
Products formerly SoFIA 3G R
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Vertical Segment
Mobile
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Processor Number
x3-C3265RK
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Lithography
28 nm
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CPU Specifications
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Total Cores
4
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Cache
1 MB L2 Cache
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Scenario Design Power (SDP)
2 W
Supplemental Information
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Marketing Status
Discontinued
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Launch Date
Q4'16
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Embedded Options Available
No
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Use Conditions
Industrial Commercial Temp, Industrial Extended Temp
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Datasheet
View now
Memory Specifications
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Max Memory Size (dependent on memory type)
2 GB
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Memory Types
1x32 LPDDR2/3 1066 2x16 DDR3L 1333
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Max # of Memory Channels
1
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Max Memory Bandwidth
4.2 GB/s
GPU Specifications
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Graphics Base Frequency
600 MHz
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Graphics Output
MIDI DSI
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Max Refresh Rate
60 Hz
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Max Resolution (eDP - Integrated Flat Panel)‡
up to 1920x1080
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OpenGL* Support
ES 2.0
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# of Displays Supported ‡
1
Package Specifications
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Sockets Supported
VF2BGA361
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Max Operating Temperature
85 °C
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Minimum Operating Temperature
-40 °C
Advanced Technologies
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Instruction Set
64-bit
Ordering and Compliance
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Retired and discontinued
Trade compliance information
- ECCN 5A992CN3
- CCATS G152457
- US HTS 8542310001
Drivers and Software
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Intel Atom® Processor C3200 Series for Yocto Project*: Release Notes and Software Package
Support
Processor Number
The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Scenario Design Power (SDP)
Scenario Design Power (SDP) is an additional thermal reference point meant to represent thermally relevant device usage in real-world environmental scenarios. It balances performance and power requirements across system workloads to represent real-world power usage. Reference product technical documentation for full power specifications.
Launch Date
The date the product was first introduced.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
Max Refresh Rate
Max Refresh Rate indicates the frequency with which a monitor's display is updated.
Max Resolution (eDP - Integrated Flat Panel)‡
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
OpenGL* Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Max Operating Temperature
This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.