Intel® Compute Module HNS7200APL


  • Product Collection Intel® Compute Module HNS7200AP Family
  • Code Name Products formerly Adams Pass
  • Marketing Status Discontinued
  • Launch Date Q2'16
  • Expected Discontinuance Q2'18
  • EOL Announce Monday, April 30, 2018
  • Last Order Sunday, September 30, 2018
  • Last Receipt Attributes Sunday, December 30, 2018
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Additional Extended Warranty Details Intel® Compute Module HNS2000 Extended Warranty
  • Compatible Product Series Intel® Xeon Phi™ Processor 7200 Series
  • Board Form Factor Custom 6.8" x 14.2"
  • Chassis Form Factor 2U Rack
  • Socket LGA 3647-1
  • Integrated BMC with IPMI Emulex Pilot III controller
  • Rack-Friendly Board Yes
  • TDP 230 W
  • Included Items Intel(R) Server Compute Module, including, (1) Intel(R) Server Board S7200APL, (1) Node Power Board FH2000NPB, (1) Bridge Board (FHWAPBGB), (1) Slot 1 Riser Card (FHW1UAP16RISER2), (1) Slot 2 Riser Card (FHW1UAP20RISER2), (3) 40x56mm dual rotor fans (FXX4056DRFAN2), (1) 1U passive heatsink (AXXAPHS), (1) air duct, and (1) 1U node tray
  • Board Chipset Intel® C612 Chipset
  • Target Market High Performance Computing

Supplemental Information

  • Embedded Options Available No
  • Description Intel® Server S7200AP Product Family provides parallelized workflows in the HPC market, featuring features support for Intel® Xeon® Phi™ processors, with 6 DIMMs (1DPC) and optional support for Intel® Omni Path® Fabric Technology.

Memory Specifications

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 1

Ordering and Compliance

Retired and discontinued

Intel® Compute Module HNS7200APL, Single

Trade compliance information

  • ECCN 5A992CN3
  • CCATS G074226+
  • US HTS 8473301180

Compatible Products

Intel® Xeon Phi™ x200 Product Family

Product Name Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon Phi™ Processor 7250F Q4'16 68 1.60 GHz 1.40 GHz 34 MB L2 Cache 230 W 27193
Intel® Xeon Phi™ Processor 7250 Q2'16 68 1.60 GHz 1.40 GHz 34 MB L2 Cache 215 W 27195
Intel® Xeon Phi™ Processor 7230F Q4'16 64 1.50 GHz 1.30 GHz 32 MB L2 Cache 230 W 27202
Intel® Xeon Phi™ Processor 7230 Q2'16 64 1.50 GHz 1.30 GHz 32 MB L2 Cache 215 W 27206
Intel® Xeon Phi™ Processor 7210F Q4'16 64 1.50 GHz 1.30 GHz 32 MB L2 Cache 230 W 27214
Intel® Xeon Phi™ Processor 7210 Q2'16 64 1.50 GHz 1.30 GHz 32 MB L2 Cache 215 W 27217

Intel® Xeon Phi™ 72x5 Processor Family

Product Name Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon Phi™ Processor 7295 Q4'17 72 1.60 GHz 1.50 GHz 36 MB L2 Cache 320 W 27235
Intel® Xeon Phi™ Processor 7285 Q4'17 68 1.40 GHz 1.30 GHz 34 MB L2 Cache 250 W 27237
Intel® Xeon Phi™ Processor 7255 Q4'17 68 1.20 GHz 1.10 GHz 34 MB L2 Cache 215 W 27239
Intel® Xeon Phi™ Processor 7235 Q4'17 64 1.40 GHz 1.30 GHz 32 MB L2 Cache 250 W 27241

Intel® Server Chassis H2000G Family

All | None

Intel® Server Board S7200AP Family

Product Name Marketing Status Board Form Factor Chassis Form Factor Socket TDP Sort Order Compare
All | None
Intel® Server Board S7200APR Discontinued Custom 6.8" x 14.2" 2U Rack LGA 3647-1 320 W 62835

Intel® RAID Controllers

Product Name Marketing Status Board Form Factor RAID Level Supported # of Ports Internal # of Ports External Cache Memory Sort Order Compare
All | None
Intel® RAID Controller RS3SC008 Discontinued MD2 low profile 0, 1, 10, 5, 50, 6, 60 0 8 1GB 63141

Cable Options

All | None

Heat-Sink Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Passive Heat-Sink AXXAPHS (80mm x 100mm) Q4'16 Discontinued 64360

I/O Options

All | None

Management Module Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Remote Management Module 4 Lite 2 AXXRMM4LITE2 Q2'16 Launched 64474
Remote Management Module AXXRMM4LITE Q2'11 Discontinued 64479
TPM Module AXXTPME6 Q1'16 Discontinued 64485

Power Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Node Power Board FH2000NPBAP Q4'16 Discontinued 64553

Spare Power Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Bridge Board Spare FHWAPBGB (for Intel® Server Chassis H2000G Family) Q4'16 Discontinued 65350

Spare Riser Card Options

All | None

Intel® Server Component Extended Warranty

All | None

Intel® Ethernet Network Adapter X710

All | None

Intel® Ethernet Converged Network Adapter X550

All | None

Intel® Ethernet Server Adapter X520

Product Name Embedded Options Available Cabling Type TDP Port Configuration System Interface Type Sort Order Compare
All | None
Intel® Ethernet Converged Network Adapter X520-QDA1 No QSFP+ Direct Attach Twin Axial Cabling up to 10m 20 W Single PCIe v3.0 (8.0 GT/s) 52374

Intel® Data Center Manager

All | None

Drivers and Software

Latest Drivers & Software

Downloads Available:


Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems

Intel® Configuration Detector for Linux*

Onboard Network Driver for Windows* for Legacy Intel® Server Boards and Systems

Intel® Server Board S7200AP Product Family Firmware Update Package


Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.


Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Quick Resume Technology

Intel® Quick Resume Technology Driver (QRTD) allows the Intel® Viiv™ technology-based PC to behave like a consumer electronic device with instant on/off (after initial boot, when activated) capability.

Intel® Quiet System Technology

Intel® Quiet System Technology can help reduce system noise and heat through more intelligent fan speed control algorithms.

Intel® Rapid Storage Technology enterprise

Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® I/O Acceleration Technology

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Build Assurance Technology

Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.