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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Ethernet Controller XL710-BM2

Specifications

Export specifications

Essentials

Supplemental Information

  • Datasheet View now
  • Description Dual Port 40GbE or 4x10GbE Ethernet Controller
  • Product Brief View now

Networking Specifications

  • Port Configuration Dual
  • Data Rate Per Port 40/10/1GbE
  • System Interface Type PCIe v3.0 (8.0 GT/s)
  • NC Sideband Interface Yes
  • Jumbo Frames Supported Yes
  • Interfaces Supported SFI, KR, KR4, XAUI, KX, KX4, SGMII

Package Specifications

  • Package Size 25mm x 25mm

Intel® Virtualization Technology for Connectivity

Advanced Technologies

Ordering and Compliance

Ordering and spec information

Intel® Ethernet Controller XL710-BM2, FCmBGA, Tray

  • MM# 947348
  • Spec Code SLLK7
  • Ordering Code FTXL710-BM2
  • Stepping B1
  • MDDS Content IDs 707999

Intel® Ethernet Controller XL710-BM2, FCmBGA, T&R

  • MM# 947349
  • Spec Code SLLK8
  • Ordering Code FTXL710-BM2
  • Stepping B1
  • MDDS Content IDs 707999

Trade compliance information

  • ECCN 5A991
  • CCATS NA
  • US HTS 8542310001

PCN Information

SLLK8

SLLK7

Drivers and Software

Latest Drivers & Software

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Flexible Port Partitioning

Flexible Port Partitioning (FPP) technology utilizes industry standard PCI SIG SR-IOV to efficiently divide your physical Ethernet device into multiple virtual devices, providing Quality of Service by ensuring each process is assigned to a Virtual Function and is provided a fair share of the bandwidth.

Virtual Machine Device Queues (VMDq)

Virtual Machine Device Queues (VMDq) is a technology designed to offload some of the switching done in the VMM (Virtual Machine Monitor) to networking hardware specifically designed for this function. VMDq drastically reduces overhead associated with I/O switching in the VMM which greatly improves throughput and overall system performance

PCI-SIG* SR-IOV Capable

Single-Root I/O Virtualization (SR-IOV) involves natively (directly) sharing a single I/O resource between multiple virtual machines. SR-IOV provides a mechanism by which a Single Root Function (for example a single Ethernet Port) can appear to be multiple separate physical devices.

Fiber Channel over Ethernet

Fibre Channel over Ethernet (FCoE) is an encapsulation of Fibre Channel frames over Ethernet networks. This allows Fibre Channel to use 10 Gigabit Ethernet networks (or higher speeds) while preserving the Fibre Channel protocol.

IEEE 1588

IEEE 1588, also knows as the Precision Time Protocol (PTP) is a protocol used to synchronize clocks throughout a computer network. On a local area network it achieves clock accuracy in the sub-microsecond range, making it suitable for measurement and control systems.

Intel® Ethernet Power Management

Intel® Ethernet Power Management Technology provides solutions to common power management approaches by reducing idle power, reducing capacity and power as a function of demand, operating at maximum energy efficiency whenever possible, and enabling functionality only when needed.

Intel® Data Direct I/O Technology

Intel® Data Direct I/O Technology is a platform technology that improves I/O data processing efficiency for data delivery and data consumption from I/O devices. With Intel DDIO, Intel® Server Adapters and controllers talk directly to the processor cache without a detour via system memory, reducing latency, increasing system I/O bandwidth, and reducing power consumption.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.