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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Compute Stick STK2m364CC

Specifications

Export specifications

Essentials

Supplemental Information

Memory & Storage

Processor Graphics

Expansion Options

I/O Specifications

  • # of USB Ports 3
  • USB Revision 3.0
  • USB 2.0 Configuration (External + Internal) 0
  • USB 3.0 Configuration (External + Internal) 1 + 2 hub
  • Integrated Wireless‡ Intel® Wireless-AC 8260 + Bluetooth 4.2
  • Integrated Bluetooth Yes

Security & Reliability

Ordering and Compliance

Retired and discontinued

Intel® Compute Stick STK2m364CC, 5 Pack

  • MM# 944721
  • Ordering Code BLKSTK2M364CC
  • MDDS Content IDs 707482

Intel® Compute Stick STK2m364CCL, 5 Pack

  • MM# 947057
  • Ordering Code BLKSTK2M364CCL

Trade compliance information

  • ECCN 5A992C
  • CCATS 740.17B1
  • US HTS 8471500150

PCN Information

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

BIOS Update for Compute Stick - CCSKLm30

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Intel® Integrator Toolkit

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Intel® HD Graphics Driver for Windows 8.1* for STK2MV64CC, STK2M364CC

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Intel® Wireless Technology-Based Driver for Windows 8.1* for STK2MV64CC, STK2M364CC

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Intel® Wireless Bluetooth® Driver for Windows 8.1* for STK2M364CC, STK2MV64CC

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Intel® Management Engine Consumer Driver for STK2m364CC

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Intel® Serial IO Driver for STK2M364CC, STK2MV64CC, STK2M3W64CC

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Intel® Chipset Device Software for STK2m364CC, STK2mv64CC, STK2m3W64CC

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Support

Launch Date

The date the product was first introduced.

Embedded Storage

Embedded Storage indicates the presence and size of onboard storage capacity that is built into the board, in addition to any drives that could be added via other interfaces.

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Warranty Period

Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Included Memory

Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Removable Memory Card Slot

Removable Card Slot indicates the presence of a slot for removable memory cards.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

TPM

Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today's software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages - operations when the keys are being used unencrypted in plain-text form.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Intel® Virtualization Technology (VT-x) ‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.