Intel® Compute Stick STK2m364CC
Specifications
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Essentials
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Product Collection
Intel® Compute Stick with 6th Generation Intel® Core™ Processors
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Code Name
Products formerly Cedar City
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Processor Included
Intel® Core™ m3-6Y30 Processor (4M Cache, up to 2.20 GHz)
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Board Number
STK2m364CC
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Supported Operating Systems
Windows 10, 64-bit*, Windows 10 IoT Enterprise*, Windows 8.1, 64-bit*, Windows Embedded 8.1 Industry*
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Supplemental Information
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Marketing Status
Discontinued
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Launch Date
Q1'16
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Warranty Period
3 yrs
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Embedded Options Available
No
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Datasheet
View now
CPU Specifications
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Total Cores
2
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Total Threads
4
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Max Turbo Frequency
2.20 GHz
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Processor Base Frequency
900 MHz
Memory & Storage
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Included Storage
64GB eMMC
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Included Memory
4GB LPDDR3-1866
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Memory Types
LPDDR3-1866
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Max # of Memory Channels
2
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Max Memory Bandwidth
29.8 GB/s
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Physical Address Extensions
32-bit
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# of Internal Drives Supported
1
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Embedded Storage
64 GB
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Removable Memory Card Slot
MicroSDXC with UHS-I support
I/O Specifications
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Graphics Output
HDMI 1.4b
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# of Displays Supported ‡
1
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# of USB Ports
3
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USB Revision
3.0
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USB 2.0 Configuration (External + Internal)
0
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USB 3.0 Configuration (External + Internal)
1 + 2 hub
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Wireless Included
Intel® Dual Band Wireless-AC 8260
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Bluetooth Version
4.2
Package Specifications
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DC Input Voltage Supported
5 VDC
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Board Form Factor
Compute Stick
Advanced Technologies
Security & Reliability
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TPM
Yes
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TPM Version
2.0
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Intel® AES New Instructions
Yes
Ordering and Compliance
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Retired and discontinued
Trade compliance information
- ECCN 5A992C
- CCATS 740.17B1
- US HTS 8471500150
Drivers and Software
Description
Type
More
OS
Version
Date
All
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Latest Drivers & Software
Name
BIOS Update for Compute Stick - CCSKLm30
Intel® Wireless Bluetooth® Driver for Windows® 10 for STK2m364CC, STK2m3W64CC, STK2mv64CC
Intel® Wireless Technology-Based Driver for Windows® 10 for STK2M3W64CC, STK2MV64CC, STK2M364CC
Intel® HD Graphics Driver for Windows® 10 for Intel® Compute Stick STK2MV64CC, STK2M364CC
Intel® Integrator Toolkit
Intel® Software Guard Extensions (Intel® SGX) for Intel® Compute Stick
Intel® HD Graphics Driver for Windows 8.1* for STK2MV64CC, STK2M364CC
Intel® Wireless Technology-Based Driver for Windows 8.1* for STK2MV64CC, STK2M364CC
Intel® Wireless Bluetooth® Driver for Windows 8.1* for STK2M364CC, STK2MV64CC
Intel® Serial IO Driver for STK2M364CC, STK2MV64CC, STK2M3W64CC
Intel® Chipset Device Software for STK2m364CC, STK2mv64CC, STK2m3W64CC
Support
Launch Date
The date the product was first introduced.
Warranty Period
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to
Included Memory
Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Physical Address Extensions
Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.
Embedded Storage
Embedded Storage indicates the presence and size of onboard storage capacity that is built into the board, in addition to any drives that could be added via other interfaces.
Removable Memory Card Slot
Removable Card Slot indicates the presence of a slot for removable memory cards.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Bluetooth Version
Devices connect wirelessly via Bluetooth technology using radio waves instead of wires or cables to connect to a phone or computer. Communication between Bluetooth devices happens over short-range, establishing a network dynamically and automatically as Bluetooth devices enter and leave radio proximity.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
TPM
Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today's software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages - operations when the keys are being used unencrypted in plain-text form.
TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.