Mobile Intel® HM170 Chipset

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Specifications

Supplemental Information

Memory Specifications

Processor Graphics

I/O Specifications

Package Specifications

  • Package Size 23mm x 23mm

Security & Reliability

Ordering and Compliance

Ordering and spec information

Intel® GL82HM170 Platform Controller Hub

  • MM# 943509
  • Spec Code SR2C4
  • Ordering Code GLHM170
  • Stepping D1

Trade compliance information

  • ECCN 5A992CN3
  • CCATS G147881
  • US HTS 8542310001

PCN/MDDS Information

SR2C4

Downloads and Software

Launch Date

The date the product was first introduced.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Supports Overclocking

Overclocking indicates the ability to achieve high core, graphics and memory frequencies by independently raising processor clock speeds without impacting other system componenets

Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

# of DIMMs per channel

DIMMs per Channel indicates the quantity of dual inline memory modules supported per each processor memory channel

Intel® Clear Video Technology

Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.

PCI Support

PCI support indicates the type of support for the Peripheral Component Interconnect standard

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link the PCH PCIe lanes to PCIe devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® vPro™ Platform Eligibility

The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vPro®

Intel® ME Firmware Version

Intel® Management Engine Firmware (Intel® ME FW) uses built-in platform capabilities and management and security applications to remotely manage networked computing assets out-of-band.

Intel® HD Audio Technology

Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.

Intel® Rapid Storage Technology

Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.

Intel® Rapid Storage Technology enterprise

Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Smart Response Technology

Intel® Smart Response Technology combines the fast performance of a small solid state drive with the large capacity of a hard disk drive.

Intel® Stable Image Platform Program (SIPP)

The Intel® Stable Image Platform Program (Intel® SIPP) aims for zero changes to key platform components and drivers for at least 15 months or until the next generational release, reducing complexity for IT to effectively manage their computing endpoints.
Learn more about Intel® SIPP

Intel® Smart Sound Technology

Intel® Smart Sound Technology is an integrated digital signal processor (DSP) for audio offload and audio/voice features

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.