Intel® Ethernet Connection X557-AT
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Intel® Ethernet Connection X557
Products formerly Coppervale
LOD: Sept/8/2020; LSD: March/8/2021
Operating Temperature Range
0°C to 55°C
Operating Temperature (Maximum)
Operating Temperature (Minimum)
Data Rate Per Port
Jumbo Frames Supported
KR, KX, 100Base-T, 1000Base-T, 10GBase-T, SGMII
19mm x 19mm
Ordering and Compliance
Retired and discontinued
Trade compliance information
- ECCN 5A991B
- CCATS G151724
- US HTS 8542310001
- 942009 PCN
- 941979 PCN
Drivers and Software
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Latest Drivers & Software
Intel® Ethernet Adapter Complete Driver Pack
This download installs version 27.6.1 of the Intel® Ethernet Adapter Complete Driver Pack for supported OS versions.View download options.
Intel® Ethernet Product Release Notes
Provides Intel® Ethernet Product Release Notes. (27.6.1)View download options.
Intel® Ethernet Connections Boot Utility, Preboot Images, and EFI Drivers
This download version 27.6 installs UEFI drivers, Intel® Boot Agent, and Intel® iSCSI Remote Boot images to program the PCI option ROM flash image and update flash configuration options.View download options.
Administrative Tools for Intel® Network Adapters
This download record installs version 27.6 of the administrative tools for Intel® Network Adapters.View download options.
Intel® Network Adapter Driver for Windows Server 2019*
This download record installs version 27.6 of the Intel® Network Adapter using Windows Server 2019*.View download options.
Adapter User Guide for Intel® Ethernet Adapters
This download contains the 27.6 version of the Intel® Ethernet Adapter User Guide.View download options.
Intel® Network Adapter Driver for Windows Server 2016*
This download record installs version 27.6 of the Intel® Network Adapter using Windows Server 2016*.View download options.
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.