Intel® Ethernet Connection X557-AT

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Specifications

Supplemental Information

  • Datasheet View now
  • Description Intel(r) Ethernet Connection X557 Family. See the Product Brief for supported devices.
  • Product Brief View now

Networking Specifications

  • Port Configuration Single
  • Data Rate Per Port 10GbE
  • Jumbo Frames Supported Yes
  • Interfaces Supported KR, KX, 100Base-T, 1000Base-T, 10GBase-T, SGMII

Package Specifications

  • Package Size 19mm x 19mm

Ordering and Compliance

Ordering and spec information

Intel® Ethernet Connection X557-AT, Single Port, FCBGA, Tray

  • MM# 941979
  • Spec Code SLKW4
  • Ordering Code EZX557AT
  • Stepping B1

Intel® Ethernet Connection X557-AT, Single Port, FCBGA, T&R

  • MM# 942009
  • Spec Code SLKW5
  • Ordering Code EZX557AT
  • Stepping B1

Trade compliance information

  • ECCN 5A991B
  • CCATS G151724
  • US HTS 8542310001

PCN/MDDS Information

SLKW5

SLKW4

Drivers and Software

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.