Intel® Ethernet Connection X557-AT


Supplemental Information

  • Datasheet View now
  • Description See PCN 117457 for EOL timelines.
    Intel(r) Ethernet Connection X557 Family. See the Product Brief for supported devices.

  • Product Brief View now

Networking Specifications

  • Port Configuration Single
  • Data Rate Per Port 10GbE
  • Jumbo Frames Supported Yes
  • Interfaces Supported KR, KX, 100Base-T, 1000Base-T, 10GBase-T, SGMII

Package Specifications

  • Package Size 19mm x 19mm

Ordering and Compliance

Retired and discontinued

Intel® Ethernet Connection X557-AT, Single Port, FCBGA, Tray

  • MM# 941979
  • Spec Code SLKW4
  • Ordering Code EZX557AT
  • Stepping B1
  • MDDS Content IDs 708253

Intel® Ethernet Connection X557-AT, Single Port, FCBGA, T&R

  • MM# 942009
  • Spec Code SLKW5
  • Ordering Code EZX557AT
  • Stepping B1
  • MDDS Content IDs 708253

Trade compliance information

  • ECCN 5A991B
  • CCATS G151724
  • US HTS 8542310001

PCN Information



Drivers and Software

Latest Drivers & Software

Downloads Available:


Intel® Ethernet Adapter Complete Driver Pack

Intel® Network Adapter Driver for Windows Server 2019*

Administrative Tools for Intel® Network Adapters

Intel® Ethernet Connections Boot Utility, Preboot Images, and EFI Drivers

Adapter User Guide for Intel® Ethernet Adapters

Intel® Network Adapter Driver for Windows Server 2016*

Intel® Ethernet Product Release Notes

Intel® Network Adapters Driver for PCIe* 10 Gigabit Network Connections Under FreeBSD*

Disabling TCP-IPv6 Checksum Offload Capability with Intel® 1/10 GbE Controllers


Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.


Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.


Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Max Operating Temperature

This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.