Intel® Ethernet Connection X557-AT2


Supplemental Information

  • Datasheet View now
  • Description Intel(r) Ethernet Connection X557 Family. See the Product Brief for supported devices.
  • Product Brief View now

Networking Specifications

  • Port Configuration Dual
  • Data Rate Per Port 10GbE
  • Jumbo Frames Supported Yes
  • Interfaces Supported KR, KX, 100Base-T, 1000Base-T, 10GBase-T, SGMII

Package Specifications

  • Package Size 19mm x 19mm
  • Low Halogen Options Available No

Ordering and Compliance

Ordering and spec information

Intel® Ethernet Connection X557-AT2, Dual Port, FCBGA, Tray

  • OrderingCode EZX557AT2
  • Stepping B1

Intel® Ethernet Connection X557-AT2, Dual Port, FCBGA, T&R

  • OrderingCode EZX557AT2
  • Stepping B1

Trade compliance information

  • ECC Varies By Product
  • PCode Varies By Product
  • HTS Varies By Product

PCN/MDDS Information



Downloads and Software

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.


Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.


Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.