Intel® Ethernet Connection X557-AT4
Specifications
Compare Intel® Products
Essentials
-
Product Collection
Intel® Ethernet Connection X557
-
Code Name
Products formerly Coppervale
-
Marketing Status
Launched
-
Launch Date
Q2'15
-
Expected Discontinuance
1H'32
-
Lithography
28 nm
-
TDP
13.6 W
-
Supported Operating Systems
View now
-
Operating Temperature Range
0°C to 55°C
-
Max Operating Temperature
55 °C
-
Minimum Operating Temperature
0 °C
Sign in with your CNDA account to view additional SKU details.
Networking Specifications
-
Port Configuration
Quad
-
Data Rate Per Port
10GbE
-
Jumbo Frames Supported
Yes
-
Interfaces Supported
KR, KX, SGMII
Package Specifications
-
Package Size
25mm x 25mm
Ordering and Compliance
Sign in with your CNDA account to view additional SKU details.
Ordering and spec information
Trade compliance information
- ECCN 5A991B
- CCATS G151724
- US HTS 8542310001
Drivers and Software
Description
Type
More
OS
Version
Date
All
View Details
Download
No results found for
Y
/apps/intel/arksuite/template/arkProductPageTemplate
Latest Drivers & Software
Name
Intel® Ethernet Adapter Complete Driver Pack
Intel® Ethernet Product Release Notes
Administrative Tools for Intel® Network Adapters
Intel® Ethernet Connections Boot Utility, Preboot Images, and EFI Drivers
Adapter User Guide for Intel® Ethernet Adapters
Disabling TCP-IPv6 Checksum Offload Capability with Intel® 1/10 GbE Controllers
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Max Operating Temperature
This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.