Intel® Compute Module HNS2600KPFR
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® Compute Module HNS2600KP Family
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Code Name
Products formerly Kennedy Pass
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Marketing Status
Discontinued
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Launch Date
Q1'16
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Expected Discontinuance
Q3'20
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Limited 3-year Warranty
Yes
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Extended Warranty Available for Purchase (Select Countries)
Yes
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Additional Extended Warranty Details
Intel® Compute Module HNS2000 Extended Warranty
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# of QPI Links
2
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Compatible Product Series
Intel® Xeon® Processor E5-2600 v4 Family
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Board Form Factor
Custom 6.4" x 17.7"
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Chassis Form Factor
Rack
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Socket
Socket R3
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Integrated Systems Available
No
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Integrated BMC with IPMI
IPMI 2.0
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Rack-Friendly Board
Yes
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TDP
145 W
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Included Items
Integrated compute module includes: (1) Intel® Server Board S2600KPFR w/two 1Gb ports (Intel® Ethernet Controller X-540) and Single InfiniBand* FDR IB port (Connect-IB* x8, QSFP+); (1) 6Gb/s bridge board (FHWKPTPBGB); (1) node power board (FH2000NPB2); (1) one slot PCIe x16 riser card (FHW1U16RISER2); (1) front 1U passive heat sinks (FXXEA84X106HS); (1) rear 1U passive heat sink (FXXCA91X91HS); (3) 4056 dual rotor fan (FXX4056DRFAN2); (1) airduct; (1) 1U node tray
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Board Chipset
Intel® C612 Chipset
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Target Market
High Performance Computing
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Supplemental Information
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Embedded Options Available
No
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Description
A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600KPFR for higher memory bandwidth, InfiniBand* FDR (56-Gb/s), and flexible configuration options for Intel® Server Chassis H2000 family.
Memory Specifications
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Max Memory Size (dependent on memory type)
512 GB
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Memory Types
DDR4-1600/1866/2133/2400
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Max # of Memory Channels
8
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Max Memory Bandwidth
153.6 GB/s
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Physical Address Extensions
46-bit
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# of Memory Slots
8
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ECC Memory Supported ‡
Yes
GPU Specifications
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Integrated Graphics ‡
Yes
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Graphics Output
VGA
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Discrete Graphics
Supported
Expansion Options
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PCI Express Revision
3.0
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Max # of PCI Express Lanes
64
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PCIe x16 Gen 3
1
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Connector for Intel® I/O Expansion Module x8 Gen 3
1
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Riser Slot 1: Total # of Lanes
16
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Riser Slot 2: Total # of Lanes
16
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Riser Slot 3: Total # of Lanes
24
I/O Specifications
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# of USB Ports
4
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USB Revision
2.0
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Total # of SATA Ports
10
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RAID Configuration
Up to SW Raid 5 (ESRT2 or RSTE)
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# of Serial Ports
1
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# of LAN Ports
2
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Integrated LAN
2x 1GbE
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Integrated InfiniBand*
Yes
Package Specifications
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Max CPU Configuration
2
Advanced Technologies
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
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Intel® Remote Management Module Support
Yes
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Intel® Node Manager
Yes
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Intel® Fast Memory Access
Yes
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Intel® Flex Memory Access
Yes
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Intel® I/O Acceleration Technology
Yes
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Intel® Advanced Management Technology
Yes
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Intel® Server Customization Technology
Yes
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Intel® Build Assurance Technology
Yes
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Intel® Efficient Power Technology
Yes
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Intel® Quiet Thermal Technology
Yes
Security & Reliability
Compatible Products
Intel® Xeon® Processor E5 v4 Family
Intel® Xeon® Processor E5 v3 Family
Intel® Server Chassis H2000G Family
Intel® Server Board S2600KP Family
RAID Accessories
Intel® RAID Controllers
Intel® RAID Software
I/O Options
Management Module Options
Riser Card Options
Spare Board Options
Spare Fan Options
Spare Heat-Sink Options
Spare Riser Card Options
Intel® Server Component Extended Warranty
Intel® Ethernet Server Adapter XL710
Intel® Ethernet Network Adapter X710
Intel® Ethernet Converged Network Adapter X550
Intel® Ethernet Converged Network Adapter X540
Intel® Ethernet Server Adapter X520
Intel® Ethernet Server Adapter I350 Series
Intel® Optane™ DC SSD Series
Intel® Data Center Manager
Drivers and Software
Description
Type
More
OS
Version
Date
All
View Details
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Latest Drivers & Software
Name
Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems
Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 61X Chipset
Intel® Server Board S2600KP Family BIOS and Firmware Update for Intel® One Boot Flash Update (Intel® OFU) and WinPE*
Intel® Server Board S2600KP Family Firmware Update Package for EFI
Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 61X Chipset
Intel® Configuration Detector for Linux*
Linux* Driver for Intel® RAID Controller RS3LC5 / RS3LC (Integrated Controller on AHWKPTP12GBGBR5 / AHWKPTP12GBGBR)
Intel® Virtual RAID on CPU (Intel® VROC SATA)/Intel® Rapid Storage Technology Enterprise (Intel® RSTe) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 61X Chipset
Intel® Embedded Server RAID Technology 2 (ESRT2) Linux* Driver for Intel® Server Boards and Systems Based on Intel® 61X Chipset
Windows* Driver for Intel® RAID Controller RS3LC5 / RS3LC (Integrated Controller on AHWKPTP12GBGBR5 / AHWKPTP12GBGBR)
Firmware Package for Intel® RAID Controller RS3LC5 / RS3LC (Integrated Controller on AHWKPTP12GBGBR5 / AHWKPTP12GBGBR)
Intel® Embedded Server RAID Technology 2 (ESRT2) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 61X Chipset
Intel® Server Board S2600KP Power Budget and Thermal Configuration Tool
InfiniBand/Mellanox* Firmware and Drivers for Intel® Server Boards and Intel® Server Systems
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
# of QPI Links
QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Physical Address Extensions
Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
PCIe x16 Gen 3
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
Connector for Intel® I/O Expansion Module x8 Gen 3
IO expansion indicates a mezzanine connector on Intel® Server Boards that support a variety of Intel® I/O Expansion Modules using a PCI Express* interface. These modules typically have external ports that are accessed on the rear I/O panel.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
# of LAN Ports
LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Integrated InfiniBand*
Infiniband is a switched fabric communications link used in high-performance computing and enterprise data centers.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Fast Memory Access
Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.
Intel® Flex Memory Access
Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.
Intel® I/O Acceleration Technology
Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.
Intel® Advanced Management Technology
Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.
Intel® Server Customization Technology
Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.
Intel® Build Assurance Technology
Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.
Intel® Efficient Power Technology
Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.
Intel® Quiet Thermal Technology
Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.