Intel® Server Board S1200SPL
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® Server Board S1200SP Family
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Code Name
Products formerly Silver Pass
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Marketing Status
Discontinued
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Launch Date
Q4'15
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Expected Discontinuance
Q1'16
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EOL Announce
Tuesday, November 15, 2016
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Last Order
Monday, January 30, 2017
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Last Receipt Attributes
Monday, March 13, 2017
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Limited 3-year Warranty
Yes
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Extended Warranty Available for Purchase (Select Countries)
Yes
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Additional Extended Warranty Details
Single Processor Board Extended Warranty
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# of QPI Links
0
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Compatible Product Series
Intel® Xeon® Processor E3-1200 v5 Family
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Board Form Factor
uATX
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Chassis Form Factor
Pedestal
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Socket
LGA 1151 Socket H4
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Integrated Systems Available
No
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Integrated BMC with IPMI
IPMI 2.0
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TDP
80 W
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Included Items
(1) Server Board; (4) SATA Data Cables; (1) I/O Shield; (1) Attention Document; (1) Quick Start User’s Guide; (1) Quick Configuration Label
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Board Chipset
Intel® C236 Chipset
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Target Market
Small and Medium Business
Supplemental Information
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Embedded Options Available
No
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Description
An entry-level single socket board with Intel® C236 chipset supporting one Intel® Xeon® Processor E3-1200 v5 family, 4 UDIMMs, Dual integrated 1GBaseT Ethernet. Supports eight SATA3 ports, M.2 SATA SSD (42mm) and Intel® Integrated RAID Module.
Memory Specifications
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Max Memory Size (dependent on memory type)
64 GB
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Memory Types
DDR4 ECC UDIMM
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Max # of Memory Channels
2
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Max Memory Bandwidth
68.256 GB/s
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Physical Address Extensions
40-bit
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Max # of DIMMs
4
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ECC Memory Supported ‡
Yes
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DIMM Type
UDIMM
Processor Graphics
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Integrated Graphics ‡
Yes
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Graphics Output
Display Port, VGA
I/O Specifications
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# of USB Ports
9
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USB Revision
2.0 & 3.0
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Total # of SATA Ports
8
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RAID Configuration
Software RAID RST (0,1,10,5) and ESRT2 (0,1,10)
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# of Serial Ports
1
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# of LAN Ports
2
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Integrated LAN
2x 1GbE
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Embedded USB (eUSB) Solid State Drive Option
No
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Integrated InfiniBand*
No
Package Specifications
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Max CPU Configuration
1
Advanced Technologies
Security & Reliability
Ordering and Compliance
Compatible Products
Intel® Xeon® Processor E3 v5 Family
6th Generation Intel® Core™ i3 Processors
Intel® Pentium® Processor G Series
Intel® Celeron® Processor G Series
Intel® Server Chassis P4000S Family
Intel® Integrated RAID (Modules/System Boards)
Intel® RAID Controllers
Intel® RAID Software
Cable Options
Management Module Options
Intel® Ethernet Server Adapter I350 Series
Drivers and Software
Description
Type
More
OS
Version
Date
All
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Latest Drivers & Software
Name
Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 23X Chipset
Intel® Server Board S1200SP BIOS and Firmware Update Package for EFI
Intel® Virtual RAID on CPU (Intel® VROC SATA)/Intel® Rapid Storage Technology Enterprise (Intel® RSTe) Windows* Driver for S1200SP Family
Intel® Configuration Detector for Linux*
Onboard Video Driver for Windows* Server 2016 for Intel® Server Boards and Systems Based on Intel® 23X Chipset
Intel® Server Board S1200SP BIOS and Firmware Update for Intel® One Boot Flash Update (Intel® OFU) Utility and WinPE*
Intel® Embedded Server RAID Technology 2 (ESRT2) Linux* Driver for S1200SP Family
Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 23X Chipset
Intel® Embedded Server RAID Technology 2 (ESRT2) Windows* Driver for S1200SP Family
Intel® Integrated RAID Module RMS3VC160 FRU fix
pGFX Graphics Driver for the Intel® Server Board S1200SPL for Windows* OS
EFI Platform Confidence Test Utility for Intel® Server Board S1200SP Family (for Test Use Only; no Technical Support)
pGFX Graphics Driver for the Intel® Server Board S1200SPL
Onboard Video Driver for Windows* for Legacy Intel® Server Boards and Systems
Intel® Server Board S1200SP Power Budget and Thermal Configuration Tool
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
# of QPI Links
QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Physical Address Extensions
Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
PCIe x4 Gen 3
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x8 Gen 3
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x16 Gen 3
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
Connector for Intel® I/O Expansion Module x8 Gen 3
IO expansion indicates a mezzanine connector on Intel® Server Boards that support a variety of Intel® I/O Expansion Modules using a PCI Express* interface. These modules typically have external ports that are accessed on the rear I/O panel.
Connector for Intel® Integrated RAID Module
Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
# of LAN Ports
LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Embedded USB (eUSB) Solid State Drive Option
Embedded USB (Universal Serial Bus) supports small USB flash storage devices which can be plugged directly into the board, and can be used for mass storage or a boot device.
Integrated InfiniBand*
Infiniband is a switched fabric communications link used in high-performance computing and enterprise data centers.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Rapid Storage Technology enterprise
Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.
Intel® I/O Acceleration Technology
Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.
TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Give Feedback
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.