Intel Atom® x3-C3230RK Processor
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel Atom® Processor X Series
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Code Name
Products formerly SoFIA 3G R
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Vertical Segment
Mobile
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Processor Number
x3-C3230RK
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Lithography
28 nm
CPU Specifications
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Total Cores
4
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Burst Frequency
1.10 GHz
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Cache
1 MB
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Scenario Design Power (SDP)
2 W
Supplemental Information
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Marketing Status
Discontinued
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Launch Date
Q1'15
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Embedded Options Available
No
Memory Specifications
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Max Memory Size (dependent on memory type)
2 GB
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Memory Types
1x32 LPDDR2/3 1066 2x16 DDR3L 1333
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Max # of Memory Channels
1
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Max Memory Bandwidth
4.2 GB/s
Processor Graphics
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Graphics Base Frequency
600 MHz
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Graphics Output
MIPI DSI
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Max Refresh Rate
60 Hz
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Max Resolution (eDP - Integrated Flat Panel)‡
up to 1920x1080
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OpenGL* Support
ES 2.0
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# of Displays Supported ‡
1
I/O Specifications
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# of USB Ports
1
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USB Revision
2.0 OTG
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General Purpose IO
4 x I2C
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UART
2 x USIF configurable
Networking Specifications
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Baseband Functions
HSDPA 21Mbps HSUPA 5.7 Mbps
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RF Transceiver
A-GOLD 620
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RF Transceiver Functions
Low power multimode multiband transceiver for 3G 2.5G 2G
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Protocol Stack
Intel Release 9 Protocol Stack
Package Specifications
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Operating Temperature Range
-25°C to 85°C
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Operating Temperature (Maximum)
85 °C
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Operating Temperature (Minimum)
-25 °C
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Package Size
11mm x 11mm
Advanced Technologies
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Secure Boot
Yes
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Instruction Set
64-bit
Drivers and Software
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Latest Drivers & Software
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Intel Atom® Processor C3200 Series for Yocto Project*: Release Notes and Software Package
Support
Processor Number
The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Burst Frequency
Burst frequency is the maximum single core frequency at which the processor is capable of operating. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Scenario Design Power (SDP)
Scenario Design Power (SDP) is an additional thermal reference point meant to represent thermally relevant device usage in real-world environmental scenarios. It balances performance and power requirements across system workloads to represent real-world power usage. Reference product technical documentation for full power specifications.
Launch Date
The date the product was first introduced.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
Max Refresh Rate
Max Refresh Rate indicates the frequency with which a monitor's display is updated.
Max Resolution (eDP - Integrated Flat Panel)‡
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
OpenGL* Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Baseband Functions
Baseband functions refers to the mobile telephony protocols supported by the baseband processor.
RF Transceiver
An RF transceiver is a chip that transmits and receives a high frequency radio signal.
RF Transceiver Functions
RF transceiver functions refers to the mobile telephony protocols supported by the RF transceiver.
Protocol Stack
Protocol stack is the software implementation of a networking protocol suite that defines the communication between each layer of the network
Secure Boot
Secure Boot ensures that only trusted software with a known configuration executes as part of the boot process. It enables the hardware root of trust which starts the authentication chain for platform firmware and subsequent software load, like the operating system, for example.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Give Feedback
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.