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The date the product was first introduced.
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Configurable TDP-up Frequency is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The Configurable TDP-up Frequency is where the Configurable TDP-up is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-up is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The use of Configurable TDP-up is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-up is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-up frequency under an Intel-defined, high-complexity workload.
Configurable TDP-down Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Frequency is where the Configurable TDP-down is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-down is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an Intel-defined, high-complexity workload.
VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.