Intel® Quark™ Microcontroller D1000
Compare Intel® Products
End of Servicing Lifetime
Embedded Options Available
Datasheet describes all publicly disclosed specifications including electrical characteristics, mechanical, and component functionality, a list of major features, a functional description, and an architectural overview.
General Purpose IO
SPI, I2C, 24GPIO
Operating Temperature Range
-40°C to 85°C
Operating Temperature (Maximum)
Operating Temperature (Minimum)
6mm x 6mm
Security & Reliability
Ordering and Compliance
Retired and discontinued
Trade compliance information
- ECCN 3A991.A.2
- CCATS NA
- US HTS 8542310001
- 938719 PCN
Drivers and Software
No results found for
The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Configurable TDP-up Base Frequency
Configurable TDP-up Base Frequency is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The Configurable TDP-up Base Frequency is where the Configurable TDP-up is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-up is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The use of Configurable TDP-up is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-up is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-up frequency under an Intel-defined, high-complexity workload.
Configurable TDP-down Base Frequency
Configurable TDP-down Base Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Base Frequency is where the Configurable TDP-down is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-down is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an Intel-defined, high-complexity workload.
The date the product was first introduced.
Intel Servicing provides functional and security updates for Intel processors or platforms, typically utilizing the Intel Platform Update (IPU).
See "Changes in Customer Support and Servicing Updates for Select Intel® Processors" for more information on servicing.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.