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  • Brand Name: Core i7

  • Product Number: i7-7500U

  • Ordering Code: SC3120AKIT

  • SPEC Code: SR2PA

  • Code Name: Kaby Lake

Intel® NUC Kit NUC5i5RYH

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Specifications

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Essentials

Supplemental Information

Processor Graphics

Expansion Options

I/O Specifications

  • # of USB Ports 6
  • USB Configuration 2x front and 2x rear USB 3.0; 2x USB 2.0 via internal headers
  • USB Revision 2.0, 3.0
  • USB 2.0 Configuration (External + Internal) 0 + 2
  • USB 3.0 Configuration (External + Internal) 2B 2F + 0
  • Total # of SATA Ports 2
  • Max # of SATA 6.0 Gb/s Ports 2
  • RAID Configuration 2.5" HDD/SSD + M.2 SATA SSD (RAID-0 RAID-1)
  • Audio (back channel + front channel) 7.1 digital (mHDMI mDP); L+R+mic (F)
  • Integrated LAN Intel® Ethernet Connection I218-V
  • Integrated Wireless‡ Intel® Wireless-AC 7265 + Bluetooth 4.2
  • Integrated Bluetooth Yes
  • Consumer Infrared Rx Sensor Yes
  • Additional Headers 2x USB2.0, AUX_PWR

Package Specifications

  • Chassis Dimensions 115 x 111 x 49mm

Security & Reliability

Compatible Products

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Drivers and Software

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Technical Documentation

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Intel vPro® Platform Eligibility ‡

The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vPro®

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency

Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Warranty Period

Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Processor Graphics ‡

Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Intel® HD Graphics, Iris™ Graphics, Iris Plus Graphics, and Iris Pro Graphics deliver enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. See the Intel® Graphics Technology page for more information.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Intel® Clear Video Technology

Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

M.2 Card Slot (storage)

M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Consumer Infrared Rx Sensor

Indicates presence of an infrared receiver sensor on Intel® NUC products, or capability of previous Intel® Desktop Boards to accept infrared receiver sensor via header.

Additional Headers

Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel vPro® Platform Eligibility ‡

The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vPro®

TPM

Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today's software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages - operations when the keys are being used unencrypted in plain-text form.

Intel® HD Audio Technology

Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.

Intel® Rapid Storage Technology

Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.

Intel® Virtualization Technology (VT-x) ‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Platform Trust Technology (Intel® PTT)

Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and key management used by Windows 8* and Windows® 10. Intel® PTT supports BitLocker* for hard drive encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM) 2.0.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.