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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® Compute Module HNS2600TPF

Specifications

Export specifications

Essentials

  • Product Collection Intel® Compute Module HNS2600TP Family
  • Code Name Products formerly Taylor Pass
  • Marketing Status Discontinued
  • Launch Date Q1'15
  • Expected Discontinuance Q4'17
  • EOL Announce Friday, November 13, 2015
  • Last Order Friday, January 29, 2016
  • Last Receipt Attributes Friday, February 26, 2016
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Additional Extended Warranty Details Intel® Compute Module HNS2000 Extended Warranty
  • # of QPI Links 2
  • Compatible Product Series Intel® Xeon® Processor E5-2600 v3 Family
  • Board Form Factor Custom 6.8" x 18.9"
  • Chassis Form Factor Rack
  • Socket Socket R3
  • Integrated Systems Available No
  • Integrated BMC with IPMI IPMI 2.0
  • Rack-Friendly Board Yes
  • TDP 145 W
  • Included Items Integrated compute module including (1) Intel® Server Board S2600TPF, (1) bridge board, (1) node power board, (1) PCIe x16 riser card, (2) 1U passive 91.5mm x 91.5mm heat sink, (3) 4056 dual rotor fan, (1) airduct, and (1) 1U node tray
  • Board Chipset Intel® C612 Chipset
  • Target Market High Performance Computing

Supplemental Information

  • Embedded Options Available No
  • Description A hot-pluggable high density compute module integrated with Intel® Server Board S2600TPF for higher memory capability and flexible configuration options for the Intel® Server Chassis H2000 family.

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Ordering and Compliance

Retired and discontinued

Intel® Compute Module HNS2600TPF, Single

Trade compliance information

  • ECCN 5A992C
  • CCATS G157815L2
  • US HTS 8473301180

Compatible Products

Intel® Xeon® Processor E5 v3 Family

Product Name Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® Processor E5-2699 v3 Q3'14 18 3.60 GHz 2.30 GHz 45 MB Intel® Smart Cache 145 W 2325
Intel® Xeon® Processor E5-2698 v3 Q3'14 16 3.60 GHz 2.30 GHz 40 MB Intel® Smart Cache 135 W 2354
Intel® Xeon® Processor E5-2697 v3 Q3'14 14 3.60 GHz 2.60 GHz 35 MB Intel® Smart Cache 145 W 2363
Intel® Xeon® Processor E5-2695 v3 Q3'14 14 3.30 GHz 2.30 GHz 35 MB Intel® Smart Cache 120 W 2386
Intel® Xeon® Processor E5-2690 v3 Q3'14 12 3.50 GHz 2.60 GHz 30 MB Intel® Smart Cache 135 W 2398
Intel® Xeon® Processor E5-2685 v3 Q3'14 12 3.30 GHz 2.60 GHz 30 MB Intel® Smart Cache 120 W 2428
Intel® Xeon® Processor E5-2683 v3 Q3'14 14 3.00 GHz 2.00 GHz 35 MB Intel® Smart Cache 120 W 2435
Intel® Xeon® Processor E5-2680 v3 Q3'14 12 3.30 GHz 2.50 GHz 30 MB Intel® Smart Cache 120 W 2439
Intel® Xeon® Processor E5-2670 v3 Q3'14 12 3.10 GHz 2.30 GHz 30 MB Intel® Smart Cache 120 W 2458
Intel® Xeon® Processor E5-2667 v3 Q3'14 8 3.60 GHz 3.20 GHz 20 MB Intel® Smart Cache 135 W 2466
Intel® Xeon® Processor E5-2660 v3 Q3'14 10 3.30 GHz 2.60 GHz 25 MB Intel® Smart Cache 105 W 2474
Intel® Xeon® Processor E5-2650L v3 Q3'14 12 2.50 GHz 1.80 GHz 30 MB Intel® Smart Cache 65 W 2488
Intel® Xeon® Processor E5-2650 v3 Q3'14 10 3.00 GHz 2.30 GHz 25 MB Intel® Smart Cache 105 W 2491
Intel® Xeon® Processor E5-2643 v3 Q3'14 6 3.70 GHz 3.40 GHz 20 MB Intel® Smart Cache 135 W 2502
Intel® Xeon® Processor E5-2640 v3 Q3'14 8 3.40 GHz 2.60 GHz 20 MB Intel® Smart Cache 90 W 2507
Intel® Xeon® Processor E5-2637 v3 Q3'14 4 3.70 GHz 3.50 GHz 15 MB Intel® Smart Cache 135 W 2514
Intel® Xeon® Processor E5-2630L v3 Q3'14 8 2.90 GHz 1.80 GHz 20 MB Intel® Smart Cache 55 W 2516
Intel® Xeon® Processor E5-2630 v3 Q3'14 8 3.20 GHz 2.40 GHz 20 MB Intel® Smart Cache 85 W 2518
Intel® Xeon® Processor E5-2623 v3 Q3'14 4 3.50 GHz 3.00 GHz 10 MB Intel® Smart Cache 105 W 2531
Intel® Xeon® Processor E5-2620 v3 Q3'14 6 3.20 GHz 2.40 GHz 15 MB Intel® Smart Cache 85 W 2535
Intel® Xeon® Processor E5-2609 v3 Q3'14 6 1.90 GHz 15 MB Intel® Smart Cache 85 W 2556
Intel® Xeon® Processor E5-2603 v3 Q3'14 6 1.60 GHz 15 MB Intel® Smart Cache 85 W 2566

Intel® Server Chassis H2000G Family

Compare
All | None

RAID Accessories

Product Name Marketing Status Board Form Factor RAID Level Supported # of Ports External Sort Order Compare
All | None
Intel® RAID Activation Key AXXRAKSW5 Discontinued Activation Key 0, 1, 10, 5, 50 0 62986

Intel® RAID Software

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All | None

I/O Options

Compare
All | None

Management Module Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Remote Management Module AXXRMM4LITE Q2'11 Discontinued 64479

Riser Card Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
1U PCI Express rIOM Riser and rIOM Carrier Board Kit AXXKPTPIOM Q4'14 Discontinued 64631

Spare Board Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
12Gb SAS Bridge Board AHWKPTP12GBGBR5 (with RAID 5) Q1'15 Discontinued 64810
Bridge Board Spare FHWKPTPBGB (for H2000XXKR2 Chassis) Q4'14 Discontinued 64819
Spare 12Gb SAS Bridge Board AHWKPTP12GBGB Q1'15 Discontinued 64841
Spare Node Power Board FH2000NPB2 Q4'14 Discontinued 64881

Spare Fan Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
40x56mm Spare Dual Rotor Fan FXX4056DRFAN2 Q4'14 Launched 65163

Spare Heat-Sink Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
1U Heat Sink FXXCA91X91HS (Cu/Al 91mmx91mm) Q1'12 Discontinued 65236

Spare Riser Card Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
1U PCI Express Riser FHW1U16RISER2 (Slot 1) Q4'14 Discontinued 65389

Intel® Server Component Extended Warranty

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Intel® Compute Module HNS2000 Extended Warranty Q3'12 Discontinued 65460
Intel® Server System H2000 Extended Warranty Q3'12 Discontinued 65464

Intel® Ethernet Server Adapter I350 Series

Compare
All | None

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems

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Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 61X Chipset

View Details

Intel® Server Board S2600TP Family Firmware Update Package for EFI

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Intel® Server Board S2600TP Family BIOS and Firmware Update for Intel® One Boot Flash Update (Intel® OFU) and WinPE*

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Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 61X Chipset

View Details

Intel® Configuration Detector for Linux*

View Details

Linux* Driver for Intel® RAID Controller RS3LC5 / RS3LC (Integrated Controller on AHWKPTP12GBGBR5 / AHWKPTP12GBGBR)

View Details

Intel® Virtual RAID on CPU (Intel® VROC SATA)/Intel® Rapid Storage Technology Enterprise (Intel® RSTe) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 61X Chipset

View Details

Intel® Embedded Server RAID Technology 2 (ESRT2) Linux* Driver for Intel® Server Boards and Systems Based on Intel® 61X Chipset

View Details

Windows* Driver for Intel® RAID Controller RS3LC5 / RS3LC (Integrated Controller on AHWKPTP12GBGBR5 / AHWKPTP12GBGBR)

View Details

Firmware Package for Intel® RAID Controller RS3LC5 / RS3LC (Integrated Controller on AHWKPTP12GBGBR5 / AHWKPTP12GBGBR)

View Details

Intel® Embedded Server RAID Technology 2 (ESRT2) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 61X Chipset

View Details

Intel® Server Board S2600TP Power Budget and Thermal Configuration Tool

View Details

InfiniBand/Mellanox* Firmware and Drivers for Intel® Server Boards and Intel® Server Systems

View Details
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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

# of QPI Links

QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Connector for Intel® I/O Expansion Module x8 Gen 3

IO expansion indicates a mezzanine connector on Intel® Server Boards that support a variety of Intel® I/O Expansion Modules using a PCI Express* interface. These modules typically have external ports that are accessed on the rear I/O panel.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Integrated InfiniBand*

Infiniband is a switched fabric communications link used in high-performance computing and enterprise data centers.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Rapid Storage Technology enterprise

Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® I/O Acceleration Technology

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Build Assurance Technology

Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.