Intel® Xeon Phi™ Coprocessor 31S1P

8GB, 1.100 GHz, 57 core

Specifications

Performance Specifications

Supplemental Information

Expansion Options

Package Specifications

  • Bracket Height Bulk packaging does not include PCI bracket

Ordering and Compliance

Ordering and spec information

Intel® Xeon Phi™ Coprocessor 31S1P (8GB, 1.100 GHz, 57 core) PCIe Card, Passively Cooled

Trade compliance information

  • ECCN 3A991
  • CCATS NA
  • US HTS 8471500150

PCN Information

Drivers and Software

Latest Drivers & Software

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Name

Support

Processor Number

The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Launch Date

The date the product was first introduced.

Servicing Status

Intel Servicing provides functional and security updates for Intel processors or platforms, typically utilizing the Intel Platform Update (IPU).

See "Changes in Customer Support and Servicing Updates for Select Intel® Processors" for more information on servicing.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.