Intel® NUC Kit DN2820FYKH
Specifications
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Essentials
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Product Collection
Legacy Intel® NUC Kits
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Code Name
Products formerly Forest Canyon
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Marketing Status
Discontinued
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Launch Date
Q4'13
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Supported Operating Systems
Windows 10, 64-bit*, Windows 8.1, 32-bit*, Windows 8.1, 64-bit*, Windows 8, 32-bit*, Windows 8, 64-bit*, Windows 7, 32-bit*, Windows 7, 64-bit*
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Board Number
DN2820FYK
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Board Form Factor
UCFF (4" x 4")
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Socket
Soldered-down BGA
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Internal Drive Form Factor
2.5" Drive
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# of Internal Drives Supported
1
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TDP
7.5 W
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DC Input Voltage Supported
12 VDC
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Processor Included
Intel® Celeron® Processor N2830 (1M Cache, up to 2.41 GHz)
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Total Cores
2
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Total Threads
2
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Processor Base Frequency
2.16 GHz
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Lithography
22 nm
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Warranty Period
3 yrs
Supplemental Information
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Embedded Options Available
No
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Datasheet
View now
Memory & Storage
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Max Memory Size (dependent on memory type)
8 GB
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Memory Types
DDR3L-1066/1333 1.35V SO-DIMM
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Max # of Memory Channels
1
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Max Memory Bandwidth
10.7 GB/s
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Max # of DIMMs
1
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ECC Memory Supported ‡
No
Processor Graphics
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Integrated Graphics ‡
Yes
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Graphics Output
HDMI 1.4a
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# of Displays Supported ‡
1
Expansion Options
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PCI Express Revision
Gen2
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PCI Express Configurations ‡
Half-length MiniPCI card with PCIe X1 lane
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PCIe Mini Card Slot (Half Length)
1
I/O Specifications
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# of USB Ports
3
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USB Configuration
1x front and 2x rear USB 2.0
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USB Revision
2.0, 3.0
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USB 2.0 Configuration (External + Internal)
2 + 0
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USB 3.0 Configuration (External + Internal)
1 + 0
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Total # of SATA Ports
1
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Max # of SATA 6.0 Gb/s Ports
1
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RAID Configuration
N/A
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Audio (back channel + front channel)
7.1 digital + analog stereo headset
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Integrated LAN
Realtek 8111GN-CG
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Integrated Wireless‡
Intel® Wireless-N 7260 + Bluetooth 4.0
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Integrated Bluetooth
Yes
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Consumer Infrared Rx Sensor
Yes
Advanced Technologies
Drivers and Software
Description
Type
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Version
Date
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Latest Drivers & Software
Name
Intel® EMA Cloud Start Tool Terraform Scripts
ITE Tech* Consumer Infrared (CIR) Driver for Windows® 10 for several Intel® NUC Products families
Intel® Integrator Toolkit
Intel® Wireless Technology-Based Driver for DN2820FY.
Intel® Wireless Bluetooth® Driver for Windows® 10 64-bit for DN2820FY
Intel® Trusted Execution Engine (Intel® TXE) Driver for DN2820FY, DE3815TY
Intel® Wireless Technology-Based Driver for Windows 7* for NUC5i3RY, NUC5i5RY, NUC5i7RY, DN2820FY
Intel® Wireless Technology-Based Driver for Windows 8.1* for NUC5i3RY, NUC5i5RY, NUC5i7RY, DN2820FY
Intel® Bluetooth® Technology-Based Driver for Windows 7* for Intel® NUC
Intel® Wireless Bluetooth® Driver for Windows 8.1* for Intel® NUC
Intel® HD Graphics Driver for DN2820FY
Realtek* Gigabit Ethernet Network Driver for Windows® 10 for DN2820FY, DE3815TY
Realtek* High Definition Audio Driver for Legacy Intel® NUC
Intel® HD Graphics Driver for Windows 7*/8.1* for DN2820FY, DE3815TY
Intel® HD Graphics Driver for Windows 8* for DN2820FY, DE3815TY
Intel® Chipset Device Software for Intel® NUC
Intel® Wireless Technology-Based Driver for Windows 8* for Intel® NUC
Intel® Embedded Media and Graphics Driver for DN2820FY
ITE Tech* Consumer Infrared (CIR) Driver for Windows 7* for Intel® NUC
Realtek* Gigabit Ethernet Network Driver for Windows 7* for Intel® NUC
ITE Tech* Consumer Infrared (CIR) Driver for Windows 8.1* for Intel® NUC
ITE Tech* Consumer Infrared (CIR) Driver for Windows 8* for Intel® NUC
Realtek* Gigabit Ethernet Network Driver for Windows 8* and 8.1* for Intel® NUC
Support
Launch Date
The date the product was first introduced.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Warranty Period
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Consumer Infrared Rx Sensor
Indicates presence of an infrared receiver sensor on Intel® NUC products, or capability of previous Intel® Desktop Boards to accept infrared receiver sensor via header.
Intel® HD Audio Technology
Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Give Feedback
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.