Intel® NUC Kit DE3815TYKHE
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Intel® NUC Kit with Intel® Atom® Processors
Products formerly Thin Canyon
Supported Operating Systems
Windows 10, 64-bit*, Windows 8.1, 32-bit*, Windows 8.1, 64-bit*, Windows 8, 32-bit*, Windows 8, 64-bit*, Windows 7, 32-bit*, Windows 7, 64-bit*, Windows Embedded 8.1 Industry*, Windows Embedded 8 Standard*, Windows Embedded Standard 7*
Board Form Factor
UCFF (4" x 4")
Internal Drive Form Factor
# of Internal Drives Supported
DC Input Voltage Supported
Intel Atom® Processor E3815 (512K Cache, 1.46 GHz)
Processor Base Frequency
# of USB Ports
1x front USB 3.0 and 2x rear USB 2.0; 3x USB 2.0 via internal headers
USB 2.0 Configuration (External + Internal)
USB 3.0 Configuration (External + Internal)
Total # of SATA Ports
Max # of SATA 6.0 Gb/s Ports
# of eSATA Ports
# of Serial Ports
Serial Port via Internal Header
Audio (back channel + front channel)
Back panel headphone/microphone jack
Wireless antennas pre-assembled
Consumer Infrared Rx Sensor
Max CPU Configuration
190mm x 116mm x 40mm
Drivers and Software
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Latest Drivers & Software
Intel® EMA Cloud Start Tool Terraform Scripts
Terraform* and PowerShell* scripts for automated creation of an Intel EMA instance and all required back-end servicesView download options.
Intel® Integrator Toolkit
Intel® Integrator Toolkit is a command line utility used to customize BIOS on Intel® NUC and Intel® Compute Stick products.View download options.
The date the product was first introduced.
Embedded Storage indicates the presence and size of onboard storage capacity that is built into the board, in addition to any drives that could be added via other interfaces.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output defines the interfaces available to communicate with display devices.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
M.2 Card Slot (wireless)
M.2 Card Slot (wireless) indicates presence of an M.2 slot that's keyed for wireless expansion cards
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Consumer Infrared Rx Sensor
Indicates presence of an infrared receiver sensor on Intel® NUC products, or capability of previous Intel® Desktop Boards to accept infrared receiver sensor via header.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today's software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages - operations when the keys are being used unencrypted in plain-text form.
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Intel® HD Audio Technology
Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.
Intel® Rapid Storage Technology
Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.