Intel® Core™ i3-4360 Processor
Specifications
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Essentials
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Product Collection
4th Generation Intel® Core™ i3 Processors
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Code Name
Products formerly Haswell
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Vertical Segment
Desktop
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Processor Number
i3-4360
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Lithography
22 nm
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CPU Specifications
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Total Cores
2
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Total Threads
4
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Processor Base Frequency
3.70 GHz
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Cache
4 MB Intel® Smart Cache
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Bus Speed
5 GT/s
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TDP
54 W
Supplemental Information
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Marketing Status
Discontinued
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Launch Date
Q2'14
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Servicing Status
End of Servicing Lifetime
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End of Servicing Updates Date
Wednesday, June 30, 2021
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Embedded Options Available
Yes
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Use Conditions
PC/Client/Tablet
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Datasheet
View now
Memory Specifications
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Max Memory Size (dependent on memory type)
32 GB
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Memory Types
DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V
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Max # of Memory Channels
2
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Max Memory Bandwidth
25.6 GB/s
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ECC Memory Supported ‡
Yes
GPU Specifications
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GPU Name‡
Intel® HD Graphics 4600
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Graphics Base Frequency
350 MHz
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Graphics Max Dynamic Frequency
1.15 GHz
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Graphics Video Max Memory
2 GB
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Graphics Output
eDP/DP/HDMI/DVI/VGA
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Max Resolution (HDMI)‡
4096x2304@24Hz
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Max Resolution (DP)‡
3840x2160@60Hz
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Max Resolution (eDP - Integrated Flat Panel)‡
3840x2160@60Hz
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Max Resolution (VGA)‡
1920x1200@60Hz
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DirectX* Support
11.1/12
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OpenGL* Support
4.3
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Intel® Quick Sync Video
Yes
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Intel® InTru™ 3D Technology
Yes
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Intel® Clear Video HD Technology
Yes
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# of Displays Supported ‡
3
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Device ID
0x412
Expansion Options
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Scalability
1S Only
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PCI Express Revision
Up to 3.0
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PCI Express Configurations ‡
Up to 1x16, 2x8, 1x8+2x4
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Max # of PCI Express Lanes
16
Package Specifications
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Sockets Supported
FCLGA1150
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Max CPU Configuration
1
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Thermal Solution Specification
PCG 2013C
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TCASE
72°C
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Package Size
37.5mm x 37.5mm
Advanced Technologies
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Intel® Turbo Boost Technology ‡
No
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Intel® Hyper-Threading Technology ‡
Yes
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Intel® Transactional Synchronization Extensions
No
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Intel® 64 ‡
Yes
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Instruction Set
64-bit
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Instruction Set Extensions
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
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Idle States
Yes
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Enhanced Intel SpeedStep® Technology
Yes
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Thermal Monitoring Technologies
Yes
Security & Reliability
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Intel® AES New Instructions
Yes
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Secure Key
Yes
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Intel® Trusted Execution Technology ‡
No
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Execute Disable Bit ‡
Yes
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Intel® Stable IT Platform Program (SIPP)
No
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Intel® Virtualization Technology (VT-x) ‡
Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
No
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Intel® VT-x with Extended Page Tables (EPT) ‡
Yes
Ordering and Compliance
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Retired and discontinued
Trade compliance information
- ECCN 5A992C
- CCATS G077159
- US HTS 8542310050
Compatible Products
Find Compatible Desktop Boards
Find boards compatible with the Intel® Core™ i3-4360 Processor in the Intel Desktop Compatibility Tool
Intel® Server Board S1200RP Family
Intel® Server System R1000RP Family
Intel® Server System P4000RP Family
Intel® 9 Series Chipsets
Intel® 8 Series Chipsets
Drivers and Software
Description
Type
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Version
Date
All
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Latest Drivers & Software
Name
Intel® Graphics Driver for Windows* [15.40]
Intel® Graphics Driver for Windows® 10 [15.40][4th Gen]
Support
Processor Number
The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Bus Speed
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Launch Date
The date the product was first introduced.
Servicing Status
Intel Servicing provides functional and security updates for Intel processors or platforms, typically utilizing the Intel Platform Update (IPU).
See "Changes in Customer Support and Servicing Updates for Select Intel® Processors" for more information on servicing.
End of Servicing Updates Date
At the End of Servicing Updates (ESU) milestone, Intel concludes servicing the broad market.
Intel reserves the right to change any ESU date.
See "Changes in Customer Support and Servicing Updates for Select Intel® Processors" for more information on servicing.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
GPU Name‡
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities.
Intel® Arc™ graphics only available on select V-Series Intel® Core™ Ultra processor-powered systems with qualifying system thermal design or H-series Intel® Core™ Ultra processor-powered systems with at least 16GB of system memory in a dual-channel configuration. OEM enablement required. Other Intel® Core™ Ultra processor-powered system configurations feature Intel® Graphics. Check with OEM or retailer for system configuration details.
Intel® Iris® Xe Graphics only: to use the Intel® Iris® Xe brand, the system must be populated with 128-bit (dual channel) memory. Otherwise, use the Intel® UHD brand.
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.
Graphics Max Dynamic Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.
Graphics Video Max Memory
The maximum amount of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU (subject to OS, driver, and other system limitations).
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
Max Resolution (HDMI)‡
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (DP)‡
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (eDP - Integrated Flat Panel)‡
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
Max Resolution (VGA)‡
Max Resolution (VGA) is the maximum resolution supported by the processor via the VGA interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
DirectX* Support
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
OpenGL* Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
Intel® Quick Sync Video
Intel® Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.
Intel® InTru™ 3D Technology
Intel® InTru™ 3D Technology provides stereoscopic 3-D Blu-ray* playback in full 1080p resolution over HDMI* 1.4 and premium audio.
Intel® Clear Video HD Technology
Intel® Clear Video HD Technology, like its predecessor, Intel® Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel® Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this processor.
TCASE
Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).
Intel® Turbo Boost Technology ‡
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading Technology ‡
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel® Transactional Synchronization Extensions
Intel® Transactional Synchronization Extensions (Intel® TSX) are a set of instructions that add hardware transactional memory support to improve performance of multi-threaded software.
Intel® 64 ‡
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Secure Key
Intel® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Intel® Stable IT Platform Program (SIPP)
The Intel® Stable IT Platform Program (Intel® SIPP) aims for zero changes to key platform components and drivers for at least 15 months or until the next generational release, reducing complexity for IT to effectively manage their computing endpoints.
Learn more about Intel® SIPP
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® VT-x with Extended Page Tables (EPT) ‡
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading for more information including details on which processors support Intel® HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information and applicability of this technology.
Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Intel® Arc™ graphics only available on select V-Series Intel® Core™ Ultra processor-powered systems with qualifying system thermal design or H-series Intel® Core™ Ultra processor-powered systems with at least 16GB of system memory in a dual-channel configuration. OEM enablement required. Other Intel® Core™ Ultra processor-powered system configurations feature Intel® Graphics. Check with OEM or retailer for system configuration details.
Intel® Iris® Xe Graphics only: to use the Intel® Iris® Xe brand, the system must be populated with 128-bit (dual channel) memory. Otherwise, use the Intel® UHD brand.