Intel® Ethernet Switch FM4105

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Specifications

Supplemental Information

  • Description An 2 10GbE ports and 16 1GbE ports, fully-integrated, single-chip wire-speed, layer-2/3/4, 10GbE/2.5GbE/1GbE Ethernet switch.

Networking Specifications

  • Maximum Port Bandwidth 36 G
  • Maximum SGMII Ports 18
  • Maximum XAUI Ports 2
  • Cut-Through Latency 300 ns
  • Frame Processing Rate 54 M pps
  • Shared Packet Memory Size 2 MB
  • Traffic Classes 8
  • MAC Table Size 16 K
  • ACL Rules 16 K
  • IPv4/IPv6 Routes 16K/4K
  • Intel® FlexPipe™ Technology No
  • Advanced Load Balancing Yes
  • CEE/DCB Features Yes
  • Server Virtualization Support Yes
  • Advanced Tunneling Features No
  • Carrier Ethernet Support No
  • CPU Interface EBI
  • Applications Data Center

Ordering and Compliance

Retired and discontinued

Intel® Ethernet Switch FM4105

  • MM# 930439
  • Spec Code SLKAM
  • Ordering Code EZFM4105F897C
  • Stepping A3

Intel® Ethernet Switch FM4105

  • MM# 930440
  • Spec Code SLKAN
  • Ordering Code EZFM4105F897E
  • Stepping A3

Trade compliance information

  • ECCN 5A991
  • CCATS NA
  • US HTS 8542310001

PCN/MDDS Information

SLKAN

SLKAM

Drivers and Software

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.