Intel® Ethernet Switch FM6724

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Specifications

Supplemental Information

  • Description A 24 10G ports or 6 40G ports, fully-integrated, single-chip wire-speed, layer-2/3/4 Ethernet switch with SDN enhancements.

Networking Specifications

  • Maximum Port Bandwidth 240 G
  • Maximum SGMII Ports 72
  • Maximum XAUI Ports 24
  • Maximum 10G KR Ports 24
  • Maximum 40G KR4 Ports 6
  • Cut-Through Latency 400 ns
  • Frame Processing Rate 360 M pps
  • Shared Packet Memory Size 8 MB
  • Traffic Classes 8
  • MAC Table Size 64 K
  • ACL Rules 24 K
  • IPv4/IPv6 Routes 64K/16K
  • Intel® FlexPipe™ Technology Yes
  • Advanced Load Balancing Yes
  • CEE/DCB Features Yes
  • Server Virtualization Support Yes
  • Advanced Tunneling Features No
  • Carrier Ethernet Support No
  • CPU Interface PCIe, EBI
  • Applications SDN

Package Specifications

  • Extended Temperature Options No
  • Package Size 42.5mm x 42.5mm

Ordering and Compliance

Retired and discontinued

Intel® Ethernet Switch FM6724

  • MM# 930424
  • Spec Code SLKAA
  • Ordering Code EZFM6724A
  • Stepping B2

Trade compliance information

  • ECCN 5A991
  • CCATS NA
  • US HTS 8542390001

PCN/MDDS Information

SLKAA

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The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.