Intel® Ethernet Switch FM5224
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A 64 2.5G ports plus 8 10G or 2 40G ports, fully-integrated, single-chip wire-speed, layer-2/3/4 Ethernet switch.
Maximum Port Bandwidth
Maximum SGMII Ports
Maximum XAUI Ports
Maximum 10G KR Ports
Maximum 40G KR4 Ports
Frame Processing Rate
360 M pps
Shared Packet Memory Size
MAC Table Size
Intel® FlexPipe™ Technology
Advanced Load Balancing
Server Virtualization Support
Advanced Tunneling Features
Carrier Ethernet Support
Extended Temperature Options
42.5mm x 42.5mm
Ordering and Compliance
Drivers and Software
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Adapter User Guide for Intel® Ethernet Adapters
This download contains the 26.8 version of the Intel® Ethernet Adapter User Guide.View download options.
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.