Intel® HM86 Chipset
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® 8 Series Chipsets
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Code Name
Products formerly Lynx Point
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Vertical Segment
Mobile
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Marketing Status
Discontinued
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Launch Date
Q2'13
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Expected Discontinuance
Q4'15
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Supported FSBs
N/A
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FSB Parity
No
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Lithography
32 nm
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TDP
2.7 W
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Use Conditions
Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet
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Supplemental Information
GPU Specifications
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Integrated Graphics ‡
No
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Graphics Output
VGA
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Intel® Clear Video Technology
Yes
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# of Displays Supported ‡
3
Expansion Options
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PCI Support
No
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PCI Express Revision
2.0
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PCI Express Configurations ‡
x1, x2, x4
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Max # of PCI Express Lanes
8
I/O Specifications
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# of USB Ports
14
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USB Revision
3.0/2.0
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USB 3.0
4
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USB 2.0
10
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Total # of SATA Ports
6
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Max # of SATA 6.0 Gb/s Ports
4
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Integrated LAN
No
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Integrated IDE
No
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Integrated SAS ports
No
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PCIe* Uplink
No
Package Specifications
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Max CPU Configuration
1
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Package Size
20mm x 20 mm x1.573mm
Advanced Technologies
Security & Reliability
Ordering and Compliance
Compatible Products
Intel® Core™ X-series Processors
4th Generation Intel® Core™ i7 Processors
4th Generation Intel® Core™ i5 Processors
4th Generation Intel® Core™ i3 Processors
Intel® Pentium® Processor 3000 Series
Intel® Celeron® Processor 2000 Series
Drivers and Software
Description
Type
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OS
Version
Date
All
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Latest Drivers & Software
Name
Intel® USB 3.0 eXtensible Host Controller Driver for Intel® 8/9/100 Series and Intel® C220/C610 Chipset Family
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Supported FSBs
FSB (Front Side Bus) is the interconnect between the processor and the Memory Controller Hub (MCH).
FSB Parity
FSB parity provides error checking on data sent on the FSB (Front Side Bus).
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
Intel® Clear Video Technology
Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.
PCI Support
PCI support indicates the type of support for the Peripheral Component Interconnect standard
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Integrated IDE
IDE (Integrated Drive Electronics) is an interface standard for connecting storage devices, and indicates the drive controller is integrated into the drive, rather than a separate component on the motherboard.
PCIe* Uplink
PCIe Uplink is an option to use additional PCIe lanes to the PCH, dedicated to storage bandwidth.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® HD Audio Technology
Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.
Intel® Rapid Storage Technology
Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.
Intel® Smart Connect Technology
Intel® Smart Connect Technology automatically updates applications such as e-mail and social networks when your computer is asleep. With Intel Smart Connect Technology, you do not have to wait for your applications to update when you wake up your computer.
Anti-Theft Technology
Intel® Anti-Theft Technology (Intel® AT) helps keep your laptop safe and secure in the event that it’s ever lost or stolen. Intel® AT requires a service subscription from an Intel® AT–enabled service provider.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.