Intel® Communications Chipset 8920
Specifications
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Essentials
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Product Collection
Intel® Communications Chipsets
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Code Name
Products formerly Cave Creek
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Vertical Segment
Embedded
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Marketing Status
Discontinued
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Launch Date
Q4'12
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TDP
12 W
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Use Conditions
Communications Commercial Temp
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Supplemental Information
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Embedded Options Available
Yes
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Datasheet
View now
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Product Brief
View now
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Additional Information
View now
Expansion Options
I/O Specifications
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# of USB Ports
6
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USB Revision
2.0
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USB 2.0
6
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Total # of SATA Ports
2
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Integrated LAN
4
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PCIe* Uplink
x16 PCIe Gen2
Package Specifications
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Max CPU Configuration
2
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Package Size
27mm x 27mm
Advanced Technologies
Ordering and Compliance
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Retired and discontinued
Trade compliance information
- ECCN 5A992C
- CCATS G184699
- US HTS 8542310001
Compatible Products
4th Generation Intel® Core™ i7 Processors
4th Generation Intel® Core™ i5 Processors
Drivers and Software
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Latest Drivers & Software
Launch Date
The date the product was first introduced.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
PCIe* Uplink
PCIe Uplink is an option to use additional PCIe lanes to the PCH, dedicated to storage bandwidth.
Integrated Intel® QuickAssist Technology
Intel® QuickAssist Technology provides security and compression acceleration capabilities used to improve performance and efficiency across the data center.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.