Intel® NUC Board D33217CK
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Legacy Intel® NUC Board
Supported Operating Systems
Windows 8.1, 32-bit*, Windows 8.1, 64-bit*, Windows 8, 32-bit*, Windows 8, 64-bit*, Windows 7, 32-bit*, Windows 7, 64-bit*, Windows XP Professional x64 Edition*
Board Form Factor
UCFF (mini PC)
Internal Drive Form Factor
# of Internal Drives Supported
DC Input Voltage Supported
Mobile Intel® QS77 Express Chipset
Intel® Core™ i3-3217U Processor (3M Cache, 1.80 GHz)
Processor Base Frequency
PCIe Mini Card Slot (Half Length)
PCIe Mini Card Slot (Full Length)
Security & Reliability
Ordering and Compliance
Drivers and Software
No results found for
The date the product was first introduced.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output defines the interfaces available to communicate with display devices.
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Intel® HD Audio Technology
Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.
Intel® Anti-Theft Technology (Intel® AT) helps keep your laptop safe and secure in the event that it’s ever lost or stolen. Intel® AT requires a service subscription from an Intel® AT–enabled service provider.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.