Intel® XMM™ 7360
Specifications
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Essentials
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Product Collection
LTE Slim Modems
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Marketing Status
Launched
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Launch Date
Q4'15
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Lithography
28 nm
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Supplemental Information
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Description
The Intel® XMM™ 7360 series combines the Intel® X-GOLD™ 736 baseband with the Intel SMARTi™ 5 transceiver in a compact, power-efficient design. Available with 5-mode LTE FDD & LTE TDD operation for China and world markets.
Networking Specifications
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Baseband Processor
X-GOLD™ 736
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Baseband Functions
LTE FDD/TDD; Cat. 10 450Mbps, 3CA DL (60MHz), 2CA UL (40 MHz), TD-SCDMA, DC-HSPA+, HSUPA, EDGE
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RF Transceiver
SMARTi™ 5
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RF Transceiver Functions
16 receiver input ports, single chip inter-band/intra-band LTE, downlink Carrier Aggregation
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Protocol Stack
Intel Release 11 Protocol Stack
Package Specifications
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Baseband Package Size
10.5 x 8.5 x 0.8 mm
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Transceiver Package Size
4.91 x 4.60 x 0.6 mm
Drivers and Software
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Latest Drivers & Software
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Baseband Processor
A baseband processor is the chip in mobile phones that performs signal processing of the mobile functions.
Baseband Functions
Baseband functions refers to the mobile telephony protocols supported by the baseband processor.
RF Transceiver
An RF transceiver is a chip that transmits and receives a high frequency radio signal.
RF Transceiver Functions
RF transceiver functions refers to the mobile telephony protocols supported by the RF transceiver.
Protocol Stack
Protocol stack is the software implementation of a networking protocol suite that defines the communication between each layer of the network
Baseband Package Size
Baseband package size indicates the physical dimensions of the baseband processor
Transceiver Package Size
Transceiver package size indicates the physical dimensions of the RF transceiver
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.