Intel® Ethernet Switch FM2112

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Specifications

Supplemental Information

  • Embedded Options Available No
  • Description An 8 10G ports and 16 1G ports fully-integrated, single-chip wire-speed, layer-2, 10G/2.5G/1G Ethernet switch.

Networking Specifications

  • Maximum Port Bandwidth 96 G
  • Maximum SGMII Ports 24
  • Maximum XAUI Ports 8
  • Cut-Through Latency 200 ns
  • Frame Processing Rate 144 M pps
  • Shared Packet Memory Size 1 MB
  • Traffic Classes 4
  • MAC Table Size 16 K
  • Intel® FlexPipe™ Technology No
  • Advanced Load Balancing No
  • CEE/DCB Features No
  • Server Virtualization Support No
  • Advanced Tunneling Features No
  • Carrier Ethernet Support No
  • CPU Interface EBI
  • Applications Data Center,FSI,HPC

Ordering and Compliance

Retired and discontinued

Intel® Ethernet Switch FM2112

  • MM# 920985
  • Spec Code SLJLS
  • Ordering Code FBFM2112F897C
  • Stepping A5

Intel® Ethernet Switch FM2112

  • MM# 920986
  • Spec Code SLJLT
  • Ordering Code FBFM2112F897E
  • Stepping A5

Intel® Ethernet Switch FM2112

  • MM# 936477
  • Spec Code SLKJE
  • Ordering Code EZFM2112F897C
  • Stepping A5

Intel® Ethernet Switch FM2112

  • MM# 936478
  • Spec Code SLKJF
  • Ordering Code EZFM2112F897E
  • Stepping A5

Trade compliance information

  • ECCN 5A991
  • CCATS NA
  • US HTS 8542390001

PCN/MDDS Information

SLKJE

SLKJF

SLJLT

SLJLS

Drivers and Software

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.