Intel® Ethernet Switch FM2224
Specifications
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Essentials
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Product Collection
Intel® Ethernet Switch FM2000 Series
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Marketing Status
Discontinued
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Launch Date
Q1'06
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Expected Discontinuance
1H'14
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Lithography
130 nm
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TDP
23.5 W
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Supplemental Information
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Embedded Options Available
No
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Description
A 24-port, fully-integrated, single-chip wire-speed, layer-2, 10G/2.5G/1G Ethernet switch.
Networking Specifications
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Maximum Port Bandwidth
240 G
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Maximum SGMII Ports
24
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Maximum XAUI Ports
24
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Cut-Through Latency
200 ns
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Frame Processing Rate
360 M pps
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Shared Packet Memory Size
1 MB
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Traffic Classes
4
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MAC Table Size
16 K
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Intel® FlexPipe™ Technology
No
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Advanced Load Balancing
No
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CEE/DCB Features
No
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Server Virtualization Support
No
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Advanced Tunneling Features
No
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Carrier Ethernet Support
No
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CPU Interface
EBI
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Applications
Data Center,FSI,HPC
Ordering and Compliance
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Retired and discontinued
Trade compliance information
- ECCN 5A991
- CCATS NA
- US HTS 8542390001
Drivers and Software
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Latest Drivers & Software
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Administrative Tools for Intel® Network Adapters
Adapter User Guide for Intel® Ethernet Adapters
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.