Intel® Ethernet Switch FM4410

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Specifications

Supplemental Information

  • Description A 24-port, fully-integrated, single-chip wire-speed, layer-2/3/4, 10G/2.5G/1G Ethernet switch.

Networking Specifications

  • Maximum Port Bandwidth 90 G
  • Maximum SGMII Ports 16
  • Maximum XAUI Ports 8
  • Cut-Through Latency 300 ns
  • Frame Processing Rate 95 M pps
  • Shared Packet Memory Size 2 MB
  • Traffic Classes 8
  • MAC Table Size 16 K
  • ACL Rules 16 K
  • IPv4/IPv6 Routes 16K/4K
  • Intel® FlexPipe™ Technology No
  • Advanced Load Balancing Yes
  • CEE/DCB Features Yes
  • Server Virtualization Support Yes
  • Advanced Tunneling Features No
  • Carrier Ethernet Support No
  • CPU Interface EBI
  • Applications Data Center,FSI,HPC

Ordering and Compliance

Retired and discontinued

Intel® Ethernet Switch FM4410

  • MM# 920988
  • Spec Code SLJM7
  • Ordering Code FBFM4410F529E
  • Stepping A3

Intel® Ethernet Switch FM4410

  • MM# 920987
  • Spec Code SLJM6
  • Ordering Code FBFM4410F529C
  • Stepping A3

Trade compliance information

  • ECCN 5A991
  • CCATS NA
  • US HTS 8542310001

PCN/MDDS Information

SLJM7

SLJM6

Drivers and Software

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.