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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Ethernet Switch FM4410

Specifications

Export specifications

Essentials

Supplemental Information

  • Description A 24-port, fully-integrated, single-chip wire-speed, layer-2/3/4, 10G/2.5G/1G Ethernet switch.

Networking Specifications

  • Maximum Port Bandwidth 90 G
  • Maximum SGMII Ports 16
  • Maximum XAUI Ports 8
  • Cut-Through Latency 300 ns
  • Frame Processing Rate 95 M pps
  • Shared Packet Memory Size 2 MB
  • Traffic Classes 8
  • MAC Table Size 16 K
  • ACL Rules 16 K
  • IPv4/IPv6 Routes 16K/4K
  • Intel® FlexPipe™ Technology No
  • Advanced Load Balancing Yes
  • CEE/DCB Features Yes
  • Server Virtualization Support Yes
  • Advanced Tunneling Features No
  • Carrier Ethernet Support No
  • CPU Interface EBI
  • Applications Data Center,FSI,HPC

Ordering and Compliance

Retired and discontinued

Intel® Ethernet Switch FM4410

  • MM# 920987
  • Spec Code SLJM6
  • Ordering Code FBFM4410F529C
  • Stepping A3
  • MDDS Content IDs 708461

Intel® Ethernet Switch FM4410

  • MM# 920988
  • Spec Code SLJM7
  • Ordering Code FBFM4410F529E
  • Stepping A3
  • MDDS Content IDs 708461

Trade compliance information

  • ECCN 5A991
  • CCATS NA
  • US HTS 8542310001

PCN Information

SLJM7

SLJM6

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Administrative Tools for Intel® Network Adapters

View Details

Adapter User Guide for Intel® Ethernet Adapters

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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.