Intel® Ethernet Switch FM4212

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Supplemental Information

  • Embedded Options Available Yes
  • Description A 12 10G port, fully-integrated, single-chip wire-speed, layer-2/3/4, 10G/2.5G/1G Ethernet switch.

Networking Specifications

  • Maximum Port Bandwidth 120 G
  • Maximum SGMII Ports 12
  • Maximum XAUI Ports 12
  • Cut-Through Latency 300 ns
  • Frame Processing Rate 180 M pps
  • Shared Packet Memory Size 2 MB
  • Traffic Classes 8
  • MAC Table Size 16 K
  • ACL Rules 16 K
  • IPv4/IPv6 Routes 16K/4K
  • Intel® FlexPipe™ Technology No
  • Advanced Load Balancing Yes
  • CEE/DCB Features Yes
  • Server Virtualization Support Yes
  • Advanced Tunneling Features No
  • Carrier Ethernet Support No
  • CPU Interface EBI
  • Applications Data Center,FSI,HPC

Ordering and Compliance

Retired and discontinued

Intel® Ethernet Switch FM4212

  • MM# 920717
  • Spec Code SLJMW
  • Ordering Code EZFM4212
  • Stepping A3

Intel® Ethernet Switch FM4212

  • MM# 921073
  • Spec Code SLJMW
  • Ordering Code EZFM4212F1433C
  • Stepping A3

Intel® Ethernet Switch FM4212

  • MM# 921070
  • Spec Code SLJMX
  • Ordering Code EZFM4212F1433E
  • Stepping A3

Intel® Ethernet Switch FM4212

  • MM# 920718
  • Spec Code SLJMX
  • Ordering Code EZFM4212
  • Stepping A3

Intel® Ethernet Switch FM4212

  • MM# 920719
  • Spec Code SLJMY
  • Ordering Code EZFM4212
  • Stepping A3

Trade compliance information

  • ECCN 5A991
  • US HTS 8542310001

PCN/MDDS Information



Drivers and Software

Latest Drivers & Software

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Technical Documentation

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.


Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.


Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.