Intel® Ethernet Switch FM4224

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Specifications

Supplemental Information

  • Description A 24-port, fully-integrated, single-chip wire-speed, layer-2/3/4, 10G/2.5G/1G Ethernet switch.

Networking Specifications

  • Maximum Port Bandwidth 240 G
  • Maximum SGMII Ports 24
  • Maximum XAUI Ports 24
  • Cut-Through Latency 300 ns
  • Frame Processing Rate 360 M pps
  • Shared Packet Memory Size 2 MB
  • Traffic Classes 8
  • MAC Table Size 16 K
  • ACL Rules 16 K
  • IPv4/IPv6 Routes 16K/4K
  • Intel® FlexPipe™ Technology No
  • Advanced Load Balancing Yes
  • CEE/DCB Features Yes
  • Server Virtualization Support Yes
  • Advanced Tunneling Features No
  • Carrier Ethernet Support No
  • CPU Interface EBI
  • Applications Data Center,FSI,HPC

Package Specifications

  • Extended Temperature Options Yes

Ordering and Compliance

Retired and discontinued

Intel® Ethernet Switch FM4224

  • MM# 921068
  • Spec Code SLJMR
  • Ordering Code EZFM4224F1433C
  • Stepping A3

Intel® Ethernet Switch FM4224

  • MM# 930428
  • Spec Code SLKAD
  • Ordering Code EZFM4224F1433E
  • Stepping A3

Intel® Ethernet Switch FM4224

  • MM# 921069
  • Spec Code SLJMS
  • Ordering Code EZFM4224F1433E
  • Stepping A3

Trade compliance information

  • ECCN 5A991
  • CCATS NA
  • US HTS 8542310001

PCN/MDDS Information

SLKAD

SLJMS

SLJMR

Drivers and Software

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Technical Documentation

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.