Intel® Ethernet Switch FM6348
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A 48 10G ports or 12 40G ports, fully-integrated, single-chip wire-speed, layer-2/3/4 Ethernet switch.
Maximum Port Bandwidth
Maximum SGMII Ports
Maximum XAUI Ports
Maximum 10G KR Ports
Maximum 40G KR4 Ports
Frame Processing Rate
720 M pps
Shared Packet Memory Size
MAC Table Size
Intel® FlexPipe™ Technology
Advanced Load Balancing
Server Virtualization Support
Advanced Tunneling Features
Carrier Ethernet Support
Extended Temperature Options
42.5mm x 42.5mm
Ordering and Compliance
Retired and discontinued
Trade compliance information
- ECCN 5A991
- CCATS NA
- US HTS 8542390001
- 930407 PCN
- 929141 PCN
Drivers and Software
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Latest Drivers & Software
Adapter User Guide for Intel® Ethernet Adapters
This download contains the 28.1.1 version of the Intel® Ethernet Adapter User Guide.View download options.
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.